JN5189THN/001Z

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of JN5189THN/001ZLast Revision (GMT):
Thursday, 25 November 2021, 04:18:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
JN5189THN/001ZSOT618HVQFN4098.255886 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 507 355152020-07-0943 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan;Suzhou, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.06108199.0000000.062165
Palladium and its compoundsPalladium, metal7440-05-30.0006171.0000000.000628
Subtotal0.061698100.00000000.062793
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.35479297.1000000.361090
Gold and its compoundsGold, metal7440-57-50.0007310.2000000.000744
Palladium and its compoundsPalladium, metal7440-05-30.0098652.7000000.010041
Subtotal0.365388100.00000000.371874
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-840.15764097.47000040.870467
Iron and its compoundsIron, metal7439-89-60.9888002.4000001.006352
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0123600.0300000.012579
Zinc and its compoundsZinc, metal7440-66-60.0412000.1000000.041931
Subtotal41.200000100.000000041.931330
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins0.8038681.5600000.818137
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.8756923.6400001.908987
Inorganic Silicon compoundsSilica, vitreous60676-86-040.50773378.61000041.226775
Inorganic Silicon compoundsSilicon dioxide7631-86-94.5037228.7400004.583666
Inorganic compoundsCarbon Black1333-86-40.0876010.1700000.089156
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.6025833.1100001.631030
Phenols and Phenolic ResinsOther phenolic resins0.1597430.3100000.162579
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-61.9890583.8600002.024365
Subtotal51.530000100.000000052.444695
Epoxy Adhesive 1Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0383893.3094000.039071
AcrylatesProprietary Material-Other acrylates0.1023728.8252000.104190
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0383893.3094000.039071
Palladium and its compoundsPalladium, metal7440-05-30.0019200.1655000.001954
PolymersProprietary Material-Other polymers0.0191941.6547000.019535
Silver and its compoundsSilver, metal7440-22-40.95973582.7358000.976771
Subtotal1.160000100.00000001.180591
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.0010005.0000000.001018
Epoxy ResinsProprietary Material-Other Epoxy resins0.00600030.0000000.006106
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01000050.0000000.010178
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0010005.0000000.001018
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.00200010.0000000.002035
Subtotal0.020000100.00000000.020355
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0089001.0000000.009058
Nickel and its compoundsNickel, metal7440-02-00.80990091.0000000.824276
Palladium and its compoundsPalladium, metal7440-05-30.0712008.0000000.072464
Subtotal0.890000100.00000000.905798
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-32.96822498.0000003.020912
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0605762.0000000.061651
Subtotal3.028800100.00000003.082564
Total98.255886100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 JN5189THN/001Z
Product content declaration of JN5189THN/001Z
上次修订 Last Revision (GMT):
Thursday, 25 November 2021, 04:18:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of JN5189THN/001ZLast Revision (GMT):
Thursday, 25 November 2021, 04:18:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Bonding Wire - CuPdAuTest Report
22 Apr 2021
Test Report
22 Apr 2021
Test Report
22 Apr 2021
Test Report
22 Apr 2021
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
CDA 194Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
NI PLATINGTest Report
10 Mar 2021
Test Report
10 Mar 2021
Test Report
10 Mar 2021
Test Report
10 Mar 2021
PD PLATINGTest Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
24 Dec 2019
Epoxy Adhesive 1Test Report
21 Jan 2021
Test Report
21 Jan 2021
Test Report
21 Jan 2021
Test Report
23 Mar 2020
Epoxy Adhesive 2Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 1DIETest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Semiconductor Die 2Test Report
19 May 2021
Test Report
19 May 2021
Not AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.