KLS1043ASE7MNLB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of KLS1043ASE7MNLBLast Revision (GMT):
Thursday, 02 June 2022, 07:23:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
KLS1043ASE7MNLBSOT1661-1FBGA6211275.808000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 687 266992021-11-0853 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped93.63916889.6000007.339597
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9405720.9000000.073724
Nickel and its compoundsNickel, metal7440-02-00.5225400.5000000.040958
Silver and its compoundsSilver, metal7440-22-40.3292000.3150000.025803
Tin and its compoundsTin, metal7440-31-59.0765208.6850000.711433
Subtotal104.508000100.00000008.191515
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.7705000.5000000.060393
Silver and its compoundsSilver, metal7440-22-44.6230003.0000000.362359
Tin and its compoundsTin, metal7440-31-5148.70650096.50000011.655868
Subtotal154.100000100.000000012.078620
SubstrateCopper PlatingCopper and its compoundsCopper, metal7440-50-8393.49554599.98000030.842850
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0787150.0200000.006170
Subtotal393.574260100.000000030.849020
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-313.27836020.8400001.040780
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-56.63280910.4100000.519891
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-63.3132195.2000000.259696
Inorganic Silicon compoundsSilicon dioxide7631-86-913.27836020.8400001.040780
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-41.9879313.1200000.155817
PolymersPlastic: EP - Epoxide, Epoxy25.22506139.5900001.977183
Subtotal63.715740100.00000004.994148
Solder BallCopper and its compoundsCopper, metal7440-50-80.8185490.5000000.064159
Silver and its compoundsSilver, metal7440-22-44.9112953.0000000.384956
Tin and its compoundsTin, metal7440-31-5157.97997696.50000012.382739
Subtotal163.709820100.000000012.831854
Solder MaskBarium and its compoundsBarium sulfate7727-43-78.94388131.1000000.701037
Copper and its compoundsCopper phthalocyanine147-14-80.0575170.2000000.004508
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1437920.5000000.011271
Magnesium and its compoundsTalc14807-96-61.0353053.6000000.081149
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3163431.1000000.024796
Organic compoundsProprietary Material-Other organic compounds.0.0287580.1000000.002254
PolymersPlastic: EP - Epoxide, Epoxy18.23286463.4000001.429123
Subtotal28.758460100.00000002.254137
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3179.10525050.00000014.038574
Inorganic Silicon compoundsSilica, vitreous60676-86-071.64210020.0000005.615430
PolymersPlastic: EP - Epoxide, Epoxy107.46315030.0000008.423144
Subtotal358.210500100.000000028.077148
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-14.30941452.3545000.337779
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.6101567.4127000.047825
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0431150.5238000.003379
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-61.84004822.3545000.144226
PolymersPlastic: EP - Epoxide, Epoxy1.42848717.3545000.111967
Subtotal8.231220100.00000000.645177
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-00.60000060.0000000.047029
Inorganic compoundsCarbon Black1333-86-40.0010000.1000000.000078
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0090000.9000000.000705
PolymersPlastic: EP - Epoxide, Epoxy0.39000039.0000000.030569
Subtotal1.000000100.00000000.078382
Total1275.808000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 KLS1043ASE7MNLB
Product content declaration of KLS1043ASE7MNLB
上次修订 Last Revision (GMT):
Thursday, 02 June 2022, 07:23:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of KLS1043ASE7MNLBLast Revision (GMT):
Thursday, 02 June 2022, 07:23:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
4 Mar 2021
Test Report
4 Mar 2021
Test Report
4 Mar 2021
Test Report
4 Mar 2021
SubstrateAUS703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPERTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
IR-6PTest Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
17 Feb 2022
SAC305Test Report
17 Nov 2021
Test Report
17 Nov 2021
Test Report
17 Nov 2021
Test Report
17 Nov 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.