KM9Z1J638BM2EPR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of KM9Z1J638BM2EPR2Last Revision (GMT):
Wednesday, 07 August 2024, 09:00:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
KM9Z1J638BM2EPR2SOT619-16HVQFN48141.479455 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 152 155782023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.40269096.0032000.284628
Palladium and its compoundsPalladium, metal7440-05-30.0167583.9953000.011845
Silver and its compoundsSilver, metal7440-22-40.0000060.0015000.000004
Subtotal0.419455100.00000000.296478
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-877.72869997.29100054.939920
Iron and its compoundsIron, metal7439-89-61.8934642.3700001.338332
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0135820.0170000.009600
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.1326220.1660000.093740
Tin and its compoundsTin, metal7440-31-50.0239680.0300000.016941
Zinc and its compoundsZinc, metal7440-66-60.1006650.1260000.071152
Subtotal79.893000100.000000056.469683
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000810.0100000.000057
Silver and its compoundsSilver, metal7440-22-40.80691999.9900000.570344
Subtotal0.807000100.00000000.570401
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-21.1620002.5000000.821321
Epoxy ResinsOther Epoxy resins2.3240005.0000001.642641
Inorganic Silicon compoundsSilica, vitreous60676-86-034.39520074.00000024.311092
Inorganic Silicon compoundsSilicon dioxide7631-86-96.04240013.0000004.270867
Inorganic compoundsCarbon Black1333-86-40.2324000.5000000.164264
Phenols and Phenolic ResinsPhenolic resin, Formaldehyde polymer with 1,1'-biphenyl and phenol628290-34-62.3240005.0000001.642641
Subtotal46.480000100.000000032.852827
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.1508005.2000000.106588
Epoxy ResinsProprietary Material-Other Epoxy resins0.1508005.2000000.106588
Imidazole compoundsProprietary Material-Other imidazole compounds0.0319001.1000000.022547
Silver and its compoundsSilver, metal7440-22-42.56650088.5000001.814044
Subtotal2.900000100.00000002.049768
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0006160.0200000.000435
Tin and its compoundsTin, metal7440-31-53.07938499.9800002.176559
Subtotal3.080000100.00000002.176995
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped3.87100098.0000002.736086
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0790002.0000000.055838
Subtotal3.950000100.00000002.791925
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped3.87100098.0000002.736086
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0790002.0000000.055838
Subtotal3.950000100.00000002.791925
Total141.479455100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 KM9Z1J638BM2EPR2
Product content declaration of KM9Z1J638BM2EPR2
上次修订 Last Revision (GMT):
Wednesday, 07 August 2024, 09:00:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of KM9Z1J638BM2EPR2Last Revision (GMT):
Wednesday, 07 August 2024, 09:00:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
20 Oct 2023
Test Report
20 Oct 2023
Test Report
20 Oct 2023
Test Report
20 Oct 2023
Copper Lead-FrameAG PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
CDA 194Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
Die EncapsulantTest Report
12 Jan 2024
Test Report
12 Jan 2024
Test Report
12 Jan 2024
Test Report
12 Jan 2024
Epoxy AdhesiveTest Report
19 Feb 2024
Test Report
19 Feb 2024
Test Report
19 Feb 2024
Test Report
19 Feb 2024
Post-plating - Lead FreeTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor Die 1Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Semiconductor Die 2Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.