KMA210:115

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of KMA210:115Last Revision (GMT):
Friday, 29 April 2022, 07:31:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
KMA210:115SOT1288SIL3285.361310 mg NoYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 643 861152022-01-24201 / Unlimited030 sec.1 / Unlimited020 sec.3Cabuyao, Philippines
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.25374798.9999000.088921
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0025380.9901000.000889
Palladium and its compoundsPalladium, metal7440-05-30.0000260.0100000.000009
Subtotal0.256310100.00000000.089819
Capacitor 1CeramicBarium and its compoundsBarium oxide1304-28-52.51559060.0000000.881546
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.41926510.0000000.146924
Titanium and its compoundsTitanium (IV) Oxide13463-67-71.25779530.0000000.440773
Subtotal4.192650100.00000001.469243
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0107100.9748000.003753
Nickel and its compoundsNickel, metal7440-02-01.08801099.0252000.381274
Subtotal1.098720100.00000000.385028
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0006300.8850000.000221
Nickel and its compoundsNickel, metal7440-02-00.07056099.1150000.024726
Subtotal0.071190100.00000000.024947
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0151202.0101000.005299
Copper and its compoundsCopper, metal7440-50-80.66968989.0284000.234681
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0604808.0402000.021194
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0069300.9213000.002429
Subtotal0.752220100.00000000.263603
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0018901.0204000.000662
Palladium and its compoundsPalladium, metal7440-05-30.18333098.9796000.064245
Subtotal0.185220100.00000000.064907
Capacitor 2CeramicBarium and its compoundsBarium oxide1304-28-52.51559060.0000000.881546
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.41926510.0000000.146924
Titanium and its compoundsTitanium (IV) Oxide13463-67-71.25779530.0000000.440773
Subtotal4.192650100.00000001.469243
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0107100.9748000.003753
Nickel and its compoundsNickel, metal7440-02-01.08801099.0252000.381274
Subtotal1.098720100.00000000.385028
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0006300.8850000.000221
Nickel and its compoundsNickel, metal7440-02-00.07056099.1150000.024726
Subtotal0.071190100.00000000.024947
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0151202.0101000.005299
Copper and its compoundsCopper, metal7440-50-80.66968989.0284000.234681
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0604808.0402000.021194
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0069300.9213000.002429
Subtotal0.752220100.00000000.263603
Palladium PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0018901.0204000.000662
Palladium and its compoundsPalladium, metal7440-05-30.18333098.9796000.064245
Subtotal0.185220100.00000000.064907
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-894.23511299.91000033.023086
Silver and its compoundsSilver, metal7440-22-40.0471600.0500000.016526
Zirconium and its compoundsZirconium, metal7440-67-70.0377280.0400000.013221
Subtotal94.320000100.000000033.052834
Die EncapsulantDie EncapsulantAntimony and its compoundsProprietary Material-Other antimony compounds2.5363501.5000000.888821
Epoxy ResinsProprietary Material-Other Epoxy resins15.2181009.0000005.332923
Halogenated Organic CompoundsProprietary Material-Other brominated organic hydrocarbons2.5363501.5000000.888821
Inorganic Silicon compoundsQuartz14808-60-7131.89020078.00000046.218669
Inorganic compoundsCarbon Black1333-86-41.6909001.0000000.592547
Phenols and Phenolic ResinsOther phenolic resins15.2181009.0000005.332923
Subtotal169.090000100.000000059.254704
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.10650010.0000000.037321
Glycidyl ethersP-Tertbutylphenyl glycidyl ether3101-60-80.0798757.5000000.027991
Guanidine compounds1-cyanoguanidine461-58-50.0053250.5000000.001866
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0745507.0000000.026125
Silver and its compoundsSilver, metal7440-22-40.79875075.0000000.279908
Subtotal1.065000100.00000000.373211
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000960.0030000.000034
Bismuth and its compoundsBismuth, metal7440-69-90.0000320.0010000.000011
Copper and its compoundsCopper, metal7440-50-80.0000320.0010000.000011
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001600.0050000.000056
Tin and its compoundsTin, metal7440-31-53.20967999.9900001.124777
Subtotal3.210000100.00000001.124890
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-31.27400098.0000000.446452
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0260002.0000000.009111
Subtotal1.300000100.00000000.455563
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-33.44960098.0000001.208853
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0704002.0000000.024671
Subtotal3.520000100.00000001.233524
Total285.361310100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 KMA210:115
Product content declaration of KMA210:115
上次修订 Last Revision (GMT):
Friday, 29 April 2022, 07:31:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

钯镀层
Palladium Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

钯镀层
Palladium Plating
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of KMA210:115Last Revision (GMT):
Friday, 29 April 2022, 07:31:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jun 2021
Test Report
22 Jun 2021
Test Report
22 Jun 2021
Test Report
22 Jun 2021
Capacitor 1Not AvailableNot AvailableNot AvailableNot Available
Capacitor 2Not AvailableNot AvailableNot AvailableNot Available
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
9 Aug 2021
Test Report
9 Aug 2021
Not AvailableNot Available
Epoxy AdhesiveTest Report
23 Mar 2021
Test Report
23 Mar 2021
Test Report
23 Mar 2021
Test Report
23 Mar 2021
Post-plating - Lead FreeTest Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Semiconductor Die 1Test Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
Semiconductor Die 2Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.