KMA310/AZ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of KMA310/AZLast Revision (GMT):
Tuesday, 11 June 2024, 10:14:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
KMA310/AZSOT1288-3SIL3290.444630 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 901 261412024-05-2091 / Unlimited26030 sec.1 / Unlimited23520 sec.3Bangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000000
Calcium and its compoundsCalcium7440-70-20.0000010.0020000.000000
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000000
Gold and its compoundsGold, metal7440-57-50.04536598.8420000.015620
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000000
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000000
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000000
Palladium and its compoundsPalladium, metal7440-05-30.0005281.1500000.000182
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000000
Subtotal0.045900100.00000000.015804
Capacitor 1CeramicBarium and its compoundsBarium oxide1304-28-51.27744159.9850000.439822
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.21296010.0000000.073322
Titanium and its compoundsTitanium dioxide1317-70-00.63919930.0150000.220076
Subtotal2.129600100.00000000.733221
GlassBoron and its compoundsBoron oxide1303-86-20.00768020.0000000.002644
Inorganic Silicon compoundsSilicon dioxide7631-86-90.03072080.0000000.010577
Subtotal0.038400100.00000000.013221
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0055811.0000000.001922
Nickel and its compoundsNickel, metal7440-02-00.55249999.0000000.190225
Subtotal0.558080100.00000000.192147
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003621.0000000.000124
Nickel and its compoundsNickel, metal7440-02-00.03579899.0000000.012325
Subtotal0.036160100.00000000.012450
Outer ElectrodeCopper and its compoundsCopper, metal7440-50-80.34024399.0000000.117146
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0034371.0000000.001183
Subtotal0.343680100.00000000.118329
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0009411.0000000.000324
Palladium and its compoundsPalladium, metal7440-05-30.09313999.0000000.032068
Subtotal0.094080100.00000000.032392
Capacitor 2CeramicBarium and its compoundsBarium oxide1304-28-50.63872059.9850000.219911
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.10648010.0000000.036661
Titanium and its compoundsTitanium dioxide1317-70-00.31960030.0150000.110038
Subtotal1.064800100.00000000.366610
GlassBoron and its compoundsBoron oxide1303-86-20.00384020.0000000.001322
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01536080.0000000.005288
Subtotal0.019200100.00000000.006611
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0027901.0000000.000961
Nickel and its compoundsNickel, metal7440-02-00.27625099.0000000.095113
Subtotal0.279040100.00000000.096073
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001811.0000000.000062
Nickel and its compoundsNickel, metal7440-02-00.01789999.0000000.006163
Subtotal0.018080100.00000000.006225
Outer ElectrodeCopper and its compoundsCopper, metal7440-50-80.17012299.0000000.058573
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0017181.0000000.000592
Subtotal0.171840100.00000000.059164
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0004701.0000000.000162
Palladium and its compoundsPalladium, metal7440-05-30.04657099.0000000.016034
Subtotal0.047040100.00000000.016196
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgAluminum and its compoundsAluminum, metal7429-90-50.0046400.0040000.001598
Copper and its compoundsCopper, metal7440-50-8115.83852899.86080039.883171
Manganese and its compoundsManganese, metal7439-96-50.0046400.0040000.001598
Zirconium and its compoundsZirconium, metal7440-67-70.1521920.1312000.052400
Subtotal116.000000100.000000039.938766
Die EncapsulantDie EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-67.4500005.0000002.565033
Inorganic Silicon compoundsSilica, vitreous60676-86-0118.45500079.50000040.784021
Inorganic compoundsCarbon Black1333-86-40.7450000.5000000.256503
Magnesium and its compoundsMagnesium dihydroxide1309-42-88.9400006.0000003.078039
Miscellaneous substancesOther miscellaneous substances (less than 10%).13.4100009.0000004.617059
Subtotal149.000000100.000000051.300656
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.98000010.0000000.337414
Glycidyl ethersP-Tertbutylphenyl glycidyl ether3101-60-80.7350007.5000000.253060
Guanidine compounds1-cyanoguanidine461-58-50.0490000.5000000.016871
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.6860007.0000000.236190
Silver and its compoundsSilver, metal7440-22-47.35000075.0000002.530603
Subtotal9.800000100.00000003.374137
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0001800.0030000.000062
Bismuth and its compoundsBismuth, metal7440-69-90.0000600.0010000.000021
Copper and its compoundsCopper, metal7440-50-80.0000600.0010000.000021
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003000.0050000.000103
Tin and its compoundsTin, metal7440-31-55.99940099.9900002.065592
Subtotal6.000000100.00000002.065798
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000700.0100000.000024
Silver and its compoundsSilver, metal7440-22-40.69993099.9900000.240986
Subtotal0.700000100.00000000.241010
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-34.01675598.0000001.382968
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0819752.0000000.028224
Subtotal4.098730100.00000001.411191
Total290.444630100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 KMA310/AZ
Product content declaration of KMA310/AZ
上次修订 Last Revision (GMT):
Tuesday, 11 June 2024, 10:14:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

钯镀层
Palladium Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

钯镀层
Palladium Plating
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of KMA310/AZLast Revision (GMT):
Tuesday, 11 June 2024, 10:14:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Capacitor 1CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER EELCTRODENot AvailableNot AvailableTest Report
6 Oct 2022
Test Report
6 Oct 2022
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Not AvailableNot Available
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
PD PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 2CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
PD PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
C151Test Report
20 Jul 2020
Test Report
20 Jul 2020
Test Report
20 Jul 2020
Test Report
20 Jul 2020
Die EncapsulantTest Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Epoxy AdhesiveTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Post-plating - Lead FreeTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Pre-plating - Precious metal - AgTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Not Available
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.