LPC11A04UK,118

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC11A04UK,118Last Revision (GMT):
Wednesday, 20 April 2022, 08:18:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC11A04UK,118OL-LPC11AxxUKWLCSP5.875290 mg YesYesYesNot ApplicableNot ApplicableNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 978 311182020-10-1571 / UnlimitedNot ApplicableNot Applicable1 / UnlimitedNot ApplicableNot ApplicableNot ApplicableNA
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-33.99180398.00000067.942230
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0814652.0000001.386576
Subtotal4.073268100.000000069.328806
Polyimide CoatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000080.0100000.000141
PolymersPolyimide Resin39355-34-50.08292299.9900001.411374
Subtotal0.082931100.00000001.411515
Redistribution MetalAluminum and its compoundsAluminum, metal7429-90-50.02355068.7391000.400822
Titanium and its compoundsTitanium, metal7440-32-60.01071031.2609000.182284
Subtotal0.034259100.00000000.583107
Solder BallCopper and its compoundsCopper, metal7440-50-80.0081000.5000000.137873
Nickel and its compoundsNickel, metal7440-02-00.0012960.0800000.022060
Silver and its compoundsSilver, metal7440-22-40.0162011.0000000.275746
Tin and its compoundsTin, metal7440-31-51.59449198.42000027.138924
Subtotal1.620088100.000000027.574603
Under Bump MetalAluminum and its compoundsAluminum, metal7429-90-50.0062809.6995000.106885
Copper and its compoundsCopper, metal7440-50-80.04162864.2968000.708531
Nickel and its compoundsNickel, metal7440-02-00.01565724.1834000.266494
Vanadium and its compoundsVanadium, metal7440-62-20.0011791.8203000.020059
Subtotal0.064744100.00000001.101969
Total5.875290100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC11A04UK,118
Product content declaration of LPC11A04UK,118
上次修订 Last Revision (GMT):
Wednesday, 20 April 2022, 08:18:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO

电气再分配
Redistribution Metal
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC11A04UK,118Last Revision (GMT):
Wednesday, 20 April 2022, 08:18:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieDIETest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
POLYIMIDETest Report
2 Nov 2021
Test Report
2 Nov 2021
Test Report
2 Nov 2021
Test Report
2 Nov 2021
RDL ALTest Report
22 Jan 2022
Test Report
22 Jan 2022
Test Report
22 Jan 2022
Test Report
22 Jan 2022
RDL TITest Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2022
SOLDER BALLTest Report
9 Feb 2022
Test Report
9 Feb 2022
Test Report
9 Feb 2022
Test Report
9 Feb 2022
UBM ALTest Report
22 Jan 2022
Test Report
22 Jan 2022
Test Report
22 Jan 2022
Test Report
22 Jan 2022
UBM CUTest Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2022
Test Report
18 Jan 2022
UBM NIVTest Report
22 Jan 2022
Test Report
22 Jan 2022
Test Report
22 Jan 2022
Test Report
22 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.