LPC11D14FBD100/302

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC11D14FBD100/302Last Revision (GMT):
Friday, 17 May 2024, 08:49:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC11D14FBD100/302SOT407-1LQFP100665.243112 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 965 915512023-11-2533 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000320.0020000.000005
Gold and its compoundsGold, metal7440-57-51.58846998.8400000.238780
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001290.0080000.000019
Palladium and its compoundsPalladium, metal7440-05-30.0184821.1500000.002778
Subtotal1.607112100.00000000.241583
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8120.25037596.20030018.076155
Inorganic Silicon compoundsSilicon7440-21-30.8125000.6500000.122136
Magnesium and its compoundsMagnesium, metal7439-95-40.1876250.1501000.028204
Nickel and its compoundsNickel, metal7440-02-03.7495002.9996000.563628
Subtotal125.000000100.000000018.790123
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins33.0750006.3000004.971867
Inorganic Silicon compoundsSilica, vitreous60676-86-0412.65000078.60000062.029955
Inorganic Silicon compoundsSilicon dioxide7631-86-957.75000011.0000008.681037
Inorganic compoundsCarbon Black1333-86-42.6250000.5000000.394593
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins18.9000003.6000002.841067
Subtotal525.000000100.000000078.918517
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.2985009.9500000.044871
Palladium and its compoundsProprietary Material-Other palladium compounds0.0015000.0500000.000226
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.30000010.0000000.045096
Silver and its compoundsSilver, metal7440-22-42.40000080.0000000.360770
Subtotal3.000000100.00000000.450963
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000300.0030000.000005
Bismuth and its compoundsBismuth, metal7440-69-90.0000100.0010000.000002
Copper and its compoundsCopper, metal7440-50-80.0000100.0010000.000002
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000500.0050000.000008
Tin and its compoundsTin, metal7440-31-50.99990099.9900000.150306
Subtotal1.000000100.00000000.150321
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001000.0100000.000015
Silver and its compoundsSilver, metal7440-22-40.99990099.9900000.150306
Subtotal1.000000100.00000000.150321
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-34.52170098.0000000.679706
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0922802.0000000.013872
Subtotal4.613980100.00000000.693578
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-33.94158098.0000000.592502
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0804402.0000000.012092
Subtotal4.022020100.00000000.604594
Total665.243112100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC11D14FBD100/302
Product content declaration of LPC11D14FBD100/302
上次修订 Last Revision (GMT):
Friday, 17 May 2024, 08:49:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC11D14FBD100/302Last Revision (GMT):
Friday, 17 May 2024, 08:49:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-FrameAG PLATINGTest Report
31 Mar 2022
Test Report
31 Mar 2022
Test Report
31 Mar 2022
Test Report
31 Mar 2022
C7025Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Die EncapsulantTest Report
19 Oct 2023
Test Report
19 Oct 2023
Test Report
19 Oct 2023
Test Report
19 Oct 2023
Epoxy AdhesiveTest Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Post-plating - Lead FreeTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Pre-plating - Precious metal - AgTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Semiconductor Die 1Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 2Not AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.