LPC1830FET100,551

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of LPC1830FET100,551Last Revision (GMT):
Sunday, 27 August 2023, 06:56:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1830FET100,551SOT926-1TFBGA100166.542988 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 963 655512023-11-25153 / 168 hours26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.00582197.8650000.003495
Gold and its compoundsGold, metal7440-57-50.0000080.1350000.000005
Palladium and its compoundsPalladium, metal7440-05-30.0001192.0000000.000071
Subtotal0.005948100.00000000.003571
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins8.40000010.5000005.043743
Inorganic Silicon compoundsQuartz14808-60-771.60000089.50000042.991903
Subtotal80.000000100.000000048.035646
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.24000010.0000000.144107
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0480002.0000000.028821
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.24000010.0000000.144107
Silver and its compoundsSilver, metal7440-22-41.87200078.0000001.124034
Subtotal2.400000100.00000001.441069
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-38.95429998.0000005.376569
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1827412.0000000.109726
Subtotal9.137040100.00000005.486295
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.1750000.5000000.105078
Silver and its compoundsSilver, metal7440-22-40.3500001.0000000.210156
Tin and its compoundsTin, metal7440-31-534.47500098.50000020.700361
Subtotal35.000000100.000000021.015595
SubstrateCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0017130.0100000.001029
Copper and its compoundsCopper, metal7440-50-817.12676099.95000010.283687
Zinc and its compoundsZinc, metal7440-66-60.0068540.0400000.004116
Subtotal17.135328100.000000010.288832
Copper PlatingCopper and its compoundsCopper, metal7440-50-89.23937899.9500005.547744
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0046220.0500000.002775
Subtotal9.244000100.00000005.550519
Gold PlatingGold and its compoundsGold, metal7440-57-50.14398699.9900000.086456
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.0100000.000009
Subtotal0.144000100.00000000.086464
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0022400.2000000.001345
Nickel and its compoundsNickel, metal7440-02-01.11776099.8000000.671154
Subtotal1.120000100.00000000.672499
Solder MaskBarium and its compoundsBarium sulfate7727-43-71.57489229.1000000.945637
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0324720.6000000.019498
Magnesium and its compoundsTalc14807-96-60.1623603.0000000.097488
Organic compoundsOther organic compounds.0.1948323.6000000.116986
PolymersPlastic: EP - Epoxide, Epoxy1.06075219.6000000.636924
PolymersPlastic: PAK2.38669244.1000001.433079
Subtotal5.412000100.00000003.249611
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-61.51393921.8000000.909038
Inorganic Silicon compoundsFibrous-glass-wool65997-17-33.11121344.8000001.868114
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0833361.2000000.050039
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4444596.4000000.266873
Phenols - SpecificBisphenol A80-05-70.0694471.0000000.041699
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]1.00003314.4000000.600465
PolymersPlastic: EP - Epoxide, Epoxy0.72224610.4000000.433669
Subtotal6.944672100.00000004.169898
Total166.542988100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC1830FET100,551
Product content declaration of LPC1830FET100,551
上次修订 Last Revision (GMT):
Sunday, 27 August 2023, 06:56:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC1830FET100,551Last Revision (GMT):
Sunday, 27 August 2023, 06:56:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
10 Apr 2023
Test Report
10 Apr 2023
Test Report
10 Apr 2023
Test Report
10 Apr 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Solder Ball - SAC, Lead FreeTest Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
SubstrateAU PLATINGTest Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
7 Oct 2023
Test Report
7 Oct 2023
COPPERTest Report
8 Feb 2023
Test Report
8 Feb 2023
Test Report
1 Mar 2022
Test Report
8 Feb 2023
CU PLATINGTest Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
NI PLATINGTest Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.