LPC1833FET256,551

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of LPC1833FET256,551Last Revision (GMT):
Thursday, 16 June 2022, 06:10:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1833FET256,551SOT740-2LBGA256743.002376 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 937 915512020-10-15123 / 168 hours26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.36469097.8650000.049083
Gold and its compoundsGold, metal7440-57-50.0005030.1350000.000068
Palladium and its compoundsPalladium, metal7440-05-30.0074532.0000000.001003
Subtotal0.372646100.00000000.050154
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins42.31500010.5000005.695137
Inorganic Silicon compoundsQuartz14808-60-7360.68500089.50000048.544259
Subtotal403.000000100.000000054.239396
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.28000010.0000000.037685
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0560002.0000000.007537
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.28000010.0000000.037685
Silver and its compoundsSilver, metal7440-22-42.18400078.0000000.293942
Subtotal2.800000100.00000000.376849
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-310.61313598.0000001.428412
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2165952.0000000.029151
Subtotal10.829730100.00000001.457563
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.6150000.5000000.082772
Silver and its compoundsSilver, metal7440-22-41.2300001.0000000.165545
Tin and its compoundsTin, metal7440-31-5121.15500098.50000016.306139
Subtotal123.000000100.000000016.554456
SubstrateCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0083000.0100000.001117
Copper and its compoundsCopper, metal7440-50-882.96222699.95000011.165809
Zinc and its compoundsZinc, metal7440-66-60.0332020.0400000.004469
Subtotal83.003728100.000000011.171395
Copper PlatingCopper and its compoundsCopper, metal7440-50-858.43476899.9500007.864681
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0292320.0500000.003934
Subtotal58.464000100.00000007.868615
Gold PlatingGold and its compoundsGold, metal7440-57-50.50744999.9900000.068297
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000510.0100000.000007
Subtotal0.507500100.00000000.068304
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0075920.2000000.001022
Nickel and its compoundsNickel, metal7440-02-03.78850899.8000000.509892
Subtotal3.796100100.00000000.510914
Solder MaskBarium and its compoundsBarium sulfate7727-43-76.86428329.1000000.923857
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1415320.6000000.019049
Magnesium and its compoundsTalc14807-96-60.7076583.0000000.095243
Organic compoundsOther organic compounds.0.8491903.6000000.114292
PolymersPlastic: EP - Epoxide, Epoxy4.62336619.6000000.622255
PolymersPlastic: PAK10.40257344.1000001.400073
Subtotal23.588600100.00000003.174768
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-67.33353621.8000000.987014
Inorganic Silicon compoundsFibrous-glass-wool65997-17-315.07075244.8000002.028358
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4036811.2000000.054331
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.1529656.4000000.289766
Phenols - SpecificBisphenol A80-05-70.3364011.0000000.045276
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]4.84417014.4000000.651972
PolymersPlastic: EP - Epoxide, Epoxy3.49856810.4000000.470869
Subtotal33.640072100.00000004.527586
Total743.002376100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC1833FET256,551
Product content declaration of LPC1833FET256,551
上次修订 Last Revision (GMT):
Thursday, 16 June 2022, 06:10:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC1833FET256,551Last Revision (GMT):
Thursday, 16 June 2022, 06:10:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Apr 2022
Test Report
15 Apr 2022
Test Report
15 Apr 2022
Test Report
15 Apr 2022
Die EncapsulantTest Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
18 Sep 2020
Test Report
18 Sep 2020
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
12 Dec 2021
Test Report
12 Dec 2021
Test Report
12 Dec 2021
Test Report
12 Dec 2021
SubstrateAU PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
AUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
CU PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
NI PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.