LPC2292FET144/00,5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC2292FET144/00,5Last Revision (GMT):
Thursday, 24 August 2023, 12:18:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC2292FET144/00,5SOT569-2TFBGA144200.640121 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 823 585512023-11-25112 / 1 year26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000270.0020000.000013
Gold and its compoundsGold, metal7440-57-51.31580898.8400000.655805
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001070.0080000.000053
Palladium and its compoundsPalladium, metal7440-05-30.0153091.1500000.007630
Subtotal1.331251100.00000000.663502
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins6.69500010.3000003.336820
Inorganic Silicon compoundsOther silica compounds58.30500089.70000029.059492
Subtotal65.000000100.000000032.396312
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.42200010.0000000.210327
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0844002.0000000.042065
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.42200010.0000000.210327
Silver and its compoundsSilver, metal7440-22-43.29160078.0000001.640549
Subtotal4.220000100.00000002.103268
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-37.92709398.0000003.950901
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1617772.0000000.080631
Subtotal8.088870100.00000004.031532
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.2700000.5000000.134569
Silver and its compoundsSilver, metal7440-22-42.1600004.0000001.076554
Tin and its compoundsTin, metal7440-31-551.57000095.50000025.702736
Subtotal54.000000100.000000026.913859
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-812.05943399.8000006.010479
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0241670.2000000.012045
Subtotal12.083600100.00000006.022524
Copper PlatingCopper and its compoundsCopper, metal7440-50-811.55144999.7500005.757298
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0289510.2500000.014429
Subtotal11.580400100.00000005.771727
Gold PlatingGold and its compoundsGold, metal7440-57-50.21027399.7500000.104801
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005270.2500000.000263
Subtotal0.210800100.00000000.105064
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0053380.2500000.002661
Nickel and its compoundsNickel, metal7440-02-02.12986299.7500001.061533
Subtotal2.135200100.00000001.064194
Solder MaskBarium and its compoundsBarium sulfate7727-43-73.67265329.1000001.830468
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0757250.6000000.037742
Magnesium and its compoundsTalc14807-96-60.3786243.0000000.188708
Organic compoundsOther organic compounds.0.4543493.6000000.226450
PolymersPlastic: EP - Epoxide, Epoxy2.47367719.6000001.232892
PolymersPlastic: PAK5.56577344.1000002.774008
Subtotal12.620800100.00000006.290267
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-66.40248621.8000003.191030
Inorganic Silicon compoundsFibrous-glass-wool65997-17-313.15740244.8000006.557712
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3524301.2000000.175653
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.8796296.4000000.936816
Phenols - SpecificBisphenol A80-05-70.2936921.0000000.146377
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)4.22916514.4000002.107836
PolymersPlastic: EP - Epoxide, Epoxy3.05439710.4000001.522326
Subtotal29.369200100.000000014.637750
Total200.640121100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC2292FET144/00,5
Product content declaration of LPC2292FET144/00,5
上次修订 Last Revision (GMT):
Thursday, 24 August 2023, 12:18:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC2292FET144/00,5Last Revision (GMT):
Thursday, 24 August 2023, 12:18:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
SubstrateAUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
7 Oct 2023
Test Report
7 Oct 2023
COPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.