LPC3180FEL320/01,5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC3180FEL320/01,5Last Revision (GMT):
Monday, 27 June 2022, 08:28:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC3180FEL320/01,5SOT824-1LFBGA320393.397950 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 869 835512022-05-0973 / 168 hours26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000880.0020000.000023
Gold and its compoundsGold, metal7440-57-54.37011298.8400001.110863
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003540.0080000.000090
Palladium and its compoundsPalladium, metal7440-05-30.0508461.1500000.012925
Subtotal4.421400100.00000001.123900
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins24.72000010.3000006.283714
Inorganic Silicon compoundsOther silica compounds215.28000089.70000054.723213
Subtotal240.000000100.000000061.006927
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.44600010.0000000.113371
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0892002.0000000.022674
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.44600010.0000000.113371
Silver and its compoundsSilver, metal7440-22-43.47880078.0000000.884295
Subtotal4.460000100.00000001.133712
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-314.33401998.0000003.643644
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2925312.0000000.074360
Subtotal14.626550100.00000003.718004
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.1344500.5000000.034177
Silver and its compoundsSilver, metal7440-22-41.0756004.0000000.273413
Tin and its compoundsTin, metal7440-31-525.67995095.5000006.527729
Subtotal26.890000100.00000006.835318
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-29.2803009.0100002.359011
Arsenic and its compoundsArsenic, metal7440-38-20.0103000.0100000.002618
Barium and its compoundsBarium sulfate7727-43-70.7931000.7700000.201602
Copper and its compoundsCopper phthalocyanine147-14-80.0103000.0100000.002618
Copper and its compoundsCopper, metal7440-50-827.83060027.0200007.074414
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-510.2691009.9700002.610359
Glycol Ethers and Acetates - SpecificEthanol, 2-(2-methoxyethoxy)-, acetate629-38-90.0103000.0100000.002618
Gold and its compoundsGold, metal7440-57-50.1957000.1900000.049746
Inorganic Silicon compoundsFibrous-glass-wool65997-17-327.83060027.0200007.074414
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4017000.3900000.102110
Magnesium and its compoundsTalc14807-96-60.4017000.3900000.102110
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.3802001.3400000.350841
Nickel and its compoundsNickel, metal7440-02-00.9064000.8800000.230403
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-510.2691009.9700002.610359
Organic compounds1,3,5-Triazine290-87-910.2691009.9700002.610359
Organic compounds3-Methoxy-3-methylbutyl acetate103429-90-90.8755000.8500000.222548
Organic compoundsDipropylene glycol monomethyl ether34590-94-80.5562000.5400000.141384
Organic compoundsHeavy aliphatic petroleum solvent64742-94-50.1442000.1400000.036655
PolymersOther acrylic resins1.5656001.5200000.397969
Subtotal103.000000100.000000026.182140
Total393.397950100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC3180FEL320/01,5
Product content declaration of LPC3180FEL320/01,5
上次修订 Last Revision (GMT):
Monday, 27 June 2022, 08:28:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC3180FEL320/01,5Last Revision (GMT):
Monday, 27 June 2022, 08:28:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Die EncapsulantTest Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
18 Sep 2020
Test Report
18 Sep 2020
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
SubstrateAUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.