LPC54607J256BD208E

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC54607J256BD208ELast Revision (GMT):
Thursday, 12 September 2024, 12:10:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC54607J256BD208ESOT459LQFP2082543.511279 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 088 595512023-11-2543 / 168 hours26030 sec.3 / 168 hours22520 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-81.65334196.5500000.065002
Gold and its compoundsGold, metal7440-57-50.0059930.3500000.000236
Palladium and its compoundsPalladium, metal7440-05-30.0530853.1000000.002087
Subtotal1.712419100.00000000.067325
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8277.56586096.20000010.912704
Inorganic Silicon compoundsSilicon7440-21-31.8754450.6500000.073734
Magnesium and its compoundsMagnesium, metal7439-95-40.4327950.1500000.017016
Nickel and its compoundsNickel, metal7440-02-08.6559003.0000000.340313
Subtotal288.530000100.000000011.343767
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins77.5516003.5000003.048998
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-677.5516003.5000003.048998
Inorganic Silicon compoundsQuartz14808-60-711.0788000.5000000.435571
Inorganic Silicon compoundsSilica, vitreous60676-86-01641.87816074.10000064.551637
Inorganic Silicon compoundsSilicon dioxide7631-86-9265.89120012.00000010.453706
Inorganic compoundsCarbon Black1333-86-48.8630400.4000000.348457
Phenols and Phenolic ResinsOther phenolic resins132.9456006.0000005.226853
Subtotal2215.760000100.000000087.114220
Epoxy AdhesiveEpoxy AdhesiveAcrylatesEthylene dimethacrylate97-90-50.0816923.3897000.003212
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.0990414.1096000.003894
Guanidine compounds1-cyanoguanidine461-58-50.0050610.2100000.000199
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2202529.1391000.008659
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.1484426.1594000.005836
Silver and its compoundsSilver, metal7440-22-41.85551276.9922000.072951
Subtotal2.410000100.00000000.094751
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0006100.0030000.000024
Bismuth and its compoundsBismuth, metal7440-69-90.0002030.0010000.000008
Copper and its compoundsCopper, metal7440-50-80.0002030.0010000.000008
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0010160.0050000.000040
Tin and its compoundsTin, metal7440-31-520.31796899.9900000.798816
Subtotal20.320000100.00000000.798896
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000260.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.25997499.9900000.010221
Subtotal0.260000100.00000000.010222
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-314.22848398.0000000.559403
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2903772.0000000.011416
Subtotal14.518860100.00000000.570820
Total2543.511279100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC54607J256BD208E
Product content declaration of LPC54607J256BD208E
上次修订 Last Revision (GMT):
Thursday, 12 September 2024, 12:10:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC54607J256BD208ELast Revision (GMT):
Thursday, 12 September 2024, 12:10:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-FrameAG PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
C7025Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Die EncapsulantTest Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Epoxy AdhesiveTest Report
17 May 2024
Test Report
17 May 2024
Test Report
17 May 2024
Test Report
17 May 2024
Post-plating - Lead FreeTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Pre-plating - Precious metal - AgTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.