LPC54S018J2MET180E

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC54S018J2MET180ELast Revision (GMT):
Wednesday, 14 April 2021, 05:17:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC54S018J2MET180ESOT570TFBGA180204.783160 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 767 565512019-02-0123 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.00225197.8650000.001099
Gold and its compoundsGold, metal7440-57-50.0000030.1350000.000002
Palladium and its compoundsPalladium, metal7440-05-30.0000462.0000000.000023
Subtotal0.002300100.00000000.001123
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins12.22200010.5000005.968264
Inorganic Silicon compoundsQuartz14808-60-7104.17800089.50000050.872347
Subtotal116.400000100.000000056.840611
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.16000010.0000000.078131
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0320002.0000000.015626
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.16000010.0000000.078131
Silver and its compoundsSilver, metal7440-22-41.24800078.0000000.609425
Subtotal1.600000100.00000000.781314
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-36.99762198.0000003.417088
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1428092.0000000.069737
Subtotal7.140430100.00000003.486825
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-36.99762198.0000003.417088
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1428092.0000000.069737
Subtotal7.140430100.00000003.486825
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.3150000.5000000.153821
Silver and its compoundsSilver, metal7440-22-40.6300001.0000000.307642
Tin and its compoundsTin, metal7440-31-562.05500098.50000030.302785
Subtotal63.000000100.000000030.764248
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-70.3643533.8353000.177922
Copper and its compoundsCopper phthalocyanine147-14-80.0450770.4745000.022012
Copper and its compoundsCopper, metal7440-50-84.63203948.7583002.261923
Epoxy ResinsOther Epoxy resins1.60190016.8621000.782242
Gold and its compoundsGold, metal7440-57-50.0201590.2122000.009844
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.60190016.8621000.782242
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0075150.0791000.003670
Magnesium and its compoundsTalc14807-96-60.0375630.3954000.018343
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0504450.5310000.024633
Nickel and its compoundsNickel, metal7440-02-00.3414773.5945000.166751
PolymersPlastic: EP - Epoxide, Epoxy0.2454042.5832000.119836
PolymersPlastic: PAK0.5521685.8123000.269636
Subtotal9.500000100.00000004.639053
Total204.783160100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC54S018J2MET180E
Product content declaration of LPC54S018J2MET180E
上次修订 Last Revision (GMT):
Wednesday, 14 April 2021, 05:17:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC54S018J2MET180ELast Revision (GMT):
Wednesday, 14 April 2021, 05:17:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
29 Apr 2020
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
25 Sep 2019
Semiconductor Die 1Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2Not AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.