LPC54S018JET180K

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of LPC54S018JET180KLast Revision (GMT):
Wednesday, 21 April 2021, 07:53:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC54S018JET180KSOT570TFBGA180103.442730 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 509 615572020-07-3023 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.00225197.8650000.002176
Gold and its compoundsGold, metal7440-57-50.0000030.1350000.000003
Palladium and its compoundsPalladium, metal7440-05-30.0000462.0000000.000044
Subtotal0.002300100.00000000.002224
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins6.93000010.5000006.699359
Inorganic Silicon compoundsQuartz14808-60-759.07000089.50000057.104061
Subtotal66.000000100.000000063.803421
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.19000010.0000000.183676
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0380002.0000000.036735
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.19000010.0000000.183676
Silver and its compoundsSilver, metal7440-22-41.48200078.0000001.432677
Subtotal1.900000100.00000001.836765
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-36.99762198.0000006.764730
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1428092.0000000.138056
Subtotal7.140430100.00000006.902786
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0950000.5000000.091838
Silver and its compoundsSilver, metal7440-22-40.1900001.0000000.183676
Tin and its compoundsTin, metal7440-31-518.71500098.50000018.092137
Subtotal19.000000100.000000018.367651
SubstrateSubstrateCopper and its compoundsCopper, metal7440-50-81.54160016.4000001.490293
Epoxy ResinsProprietary Material-Other Epoxy resins1.60740017.1000001.553903
Gold and its compoundsGold, metal7440-57-50.0094000.1000000.009087
Inorganic Silicon compoundsOther silica compounds2.94220031.3000002.844279
Miscellaneous substancesProprietary Material-Other miscellaneous substances.2.51920026.8000002.435357
Nickel and its compoundsNickel, metal7440-02-00.0564000.6000000.054523
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.7238007.7000000.699711
Subtotal9.400000100.00000009.087154
Total103.442730100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC54S018JET180K
Product content declaration of LPC54S018JET180K
上次修订 Last Revision (GMT):
Wednesday, 21 April 2021, 07:53:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC54S018JET180KLast Revision (GMT):
Wednesday, 21 April 2021, 07:53:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
29 Apr 2020
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
25 Sep 2019
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
SubstrateAU PLATINGTest Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
AUS 308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
COPPERTest Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
CU PLATINGTest Report
3 Jan 2020
Test Report
3 Jan 2020
Test Report
3 Jan 2020
Test Report
3 Jan 2020
HL832NXATest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
NI PLATINGTest Report
14 May 2020
Test Report
14 May 2020
Test Report
14 May 2020
Test Report
14 May 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.