LPC5526JBD64K

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of LPC5526JBD64KLast Revision (GMT):
Thursday, 16 June 2022, 04:41:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC5526JBD64KSOT855HTQFP64272.485530 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 805 565572022-05-0923 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.40460397.8650000.148486
Gold and its compoundsGold, metal7440-57-50.0005580.1350000.000205
Palladium and its compoundsPalladium, metal7440-05-30.0082692.0000000.003034
Subtotal0.413430100.00000000.151725
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8114.28595696.20030041.942028
Inorganic Silicon compoundsSilicon7440-21-30.7722000.6500000.283391
Magnesium and its compoundsMagnesium, metal7439-95-40.1783190.1501000.065442
Nickel and its compoundsNickel, metal7440-02-03.5635252.9996001.307785
Subtotal118.800000100.000000043.598646
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins2.0280001.5600000.744260
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-64.7320003.6400001.736606
Inorganic Silicon compoundsSilica, vitreous60676-86-0102.19300078.61000037.504010
Inorganic Silicon compoundsSilicon dioxide7631-86-911.3620008.7400004.169763
Inorganic compoundsCarbon Black1333-86-40.2210000.1700000.081105
Miscellaneous substancesOther miscellaneous substances (less than 10%).4.0430003.1100001.483748
Phenols and Phenolic ResinsOther phenolic resins0.4030000.3100000.147898
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-65.0180003.8600001.841566
Subtotal130.000000100.000000047.708955
Epoxy AdhesiveEpoxy AdhesiveMiscellaneous substancesOther miscellaneous substances (less than 10%).0.1274009.1000000.046755
PolymersOther acrylic resins0.1190008.5000000.043672
PolymersPlastic: EP - Epoxide, Epoxy0.0182001.3000000.006679
PolymersPlastic: PBR - Polybutadiene Rubber0.0672004.8000000.024662
Silver and its compoundsSilver, metal7440-22-41.06820076.3000000.392021
Subtotal1.400000100.00000000.513789
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0003900.0030000.000143
Bismuth and its compoundsBismuth, metal7440-69-90.0001300.0010000.000048
Copper and its compoundsCopper, metal7440-50-80.0001300.0010000.000048
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0006500.0050000.000238
Tin and its compoundsTin, metal7440-31-512.99870099.9900004.770418
Subtotal13.000000100.00000004.770895
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001300.0100000.000048
Silver and its compoundsSilver, metal7440-22-41.29987099.9900000.477042
Subtotal1.300000100.00000000.477089
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-37.42065898.0000002.723322
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1514422.0000000.055578
Subtotal7.572100100.00000002.778900
Total272.485530100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC5526JBD64K
Product content declaration of LPC5526JBD64K
上次修订 Last Revision (GMT):
Thursday, 16 June 2022, 04:41:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC5526JBD64KLast Revision (GMT):
Thursday, 16 June 2022, 04:41:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Apr 2022
Test Report
15 Apr 2022
Test Report
15 Apr 2022
Test Report
15 Apr 2022
Copper Lead-FrameNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
19 Jul 2021
Test Report
19 Jul 2021
Test Report
19 Jul 2021
Test Report
19 Jul 2021
Post-plating - Lead FreeTest Report
13 Aug 2021
Test Report
13 Aug 2021
Test Report
13 Aug 2021
Test Report
13 Aug 2021
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
27 Apr 2022
Test Report
27 Apr 2022
Test Report
27 Apr 2022
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.