LS1023ABE9MQB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LS1023ABE9MQBLast Revision (GMT):
Thursday, 21 April 2022, 01:44:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LS1023ABE9MQBSOT1653FBGA7803587.800000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 824 275572020-07-0983 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.81520040.0000000.134210
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.80570015.0000000.050329
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.41710045.0000000.150987
Subtotal12.038000100.00000000.335526
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-82156.05500098.45000060.094069
Nickel and its compoundsNickel, metal7440-02-033.9450001.5500000.946123
Subtotal2190.000000100.000000061.040192
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped93.63916889.6000002.609933
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9405720.9000000.026216
Nickel and its compoundsNickel, metal7440-02-00.5225400.5000000.014564
Silver and its compoundsSilver, metal7440-22-40.3292000.3150000.009175
Tin and its compoundsTin, metal7440-31-59.0765208.6850000.252983
Subtotal104.508000100.00000002.912871
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9677800.5000000.026974
Silver and its compoundsSilver, metal7440-22-45.8066803.0000000.161845
Tin and its compoundsTin, metal7440-31-5186.78154096.5000005.206019
Subtotal193.556000100.00000005.394838
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-74.1118820.3878000.114607
Copper and its compoundsCopper, metal7440-50-8506.39663447.75930014.114405
Epoxy ResinsProprietary Material-Other Epoxy resins278.01010126.2197007.748762
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3224.50791921.1738006.257537
Inorganic Silicon compoundsSilicon dioxide7631-86-929.3705872.7700000.818624
Silver and its compoundsSilver, metal7440-22-40.5396980.0509000.015043
Tin and its compoundsTin, metal7440-31-517.3731791.6385000.484229
Subtotal1060.310000100.000000029.553208
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-510.37448072.0000000.289160
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.44090010.0000000.040161
Zinc and its compoundsZinc oxide1314-13-22.59362018.0000000.072290
Subtotal14.409000100.00000000.401611
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-07.78740060.0000000.217052
Inorganic compoundsCarbon Black1333-86-40.0129790.1000000.000362
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1168110.9000000.003256
PolymersPlastic: EP - Epoxide, Epoxy5.06181039.0000000.141084
Subtotal12.979000100.00000000.361754
Total3587.800000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LS1023ABE9MQB
Product content declaration of LS1023ABE9MQB
上次修订 Last Revision (GMT):
Thursday, 21 April 2022, 01:44:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LS1023ABE9MQBLast Revision (GMT):
Thursday, 21 April 2022, 01:44:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2022
Test Report
3 Mar 2021
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Heat SpreaderC1100Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
NI PLATINGTest Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Test Report
15 Jun 2021
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
4 Mar 2021
Test Report
4 Mar 2021
Test Report
4 Mar 2021
Test Report
4 Mar 2021
SubstrateCOPPERTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
PHP-900 IR-6Test Report
18 Jun 2021
Test Report
19 Aug 2021
Test Report
18 Jun 2021
Test Report
16 Jul 2020
SR7300 SERIESTest Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Thermally Conductive GelTest Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.