LS1043AXE7PQB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LS1043AXE7PQBLast Revision (GMT):
Thursday, 02 June 2022, 07:32:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LS1043AXE7PQBSOT1661-1FBGA6211287.707000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 389 055572021-11-08103 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped93.63916889.6000007.271776
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9405720.9000000.073042
Nickel and its compoundsNickel, metal7440-02-00.5225400.5000000.040579
Silver and its compoundsSilver, metal7440-22-40.3292000.3150000.025565
Tin and its compoundsTin, metal7440-31-59.0765208.6850000.704859
Subtotal104.508000100.00000008.115821
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.7709950.5000000.059874
Silver and its compoundsSilver, metal7440-22-44.6259703.0000000.359241
Tin and its compoundsTin, metal7440-31-5148.80203596.50000011.555582
Subtotal154.199000100.000000011.974696
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8452.36590199.90000035.129568
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4528190.1000000.035165
Subtotal452.818720100.000000035.164732
SolderCopper and its compoundsCopper, metal7440-50-80.0858690.5000000.006668
Silver and its compoundsSilver, metal7440-22-40.5152133.0000000.040010
Tin and its compoundsTin, metal7440-31-516.57269896.5000001.286993
Subtotal17.173780100.00000001.333671
Solder MaskBarium and its compoundsBarium sulfate7727-43-77.58491731.1000000.589025
Copper and its compoundsCopper phthalocyanine147-14-80.0487780.2000000.003788
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1219440.5000000.009470
Magnesium and its compoundsTalc14807-96-60.8779973.6000000.068183
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2682771.1000000.020834
Organic compoundsOther organic compounds.0.0243890.1000000.001894
PolymersPlastic: EP - Epoxide, Epoxy15.46249963.4000001.200778
Subtotal24.388800100.00000001.893971
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-313.39092510.4500001.039905
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-513.39092510.4500001.039905
Inorganic Silicon compoundsSilicon dioxide7631-86-953.62777041.8500004.164594
PolymersPlastic: EP - Epoxide, Epoxy47.73320137.2500003.706837
Subtotal128.142820100.00000009.951240
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3196.83794050.00000015.285926
Inorganic Silicon compoundsSilica, vitreous60676-86-019.6837945.0000001.528593
PolymersPlastic: EP - Epoxide, Epoxy177.15414645.00000013.757333
Subtotal393.675880100.000000030.571852
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-07.68000060.0000000.596409
Inorganic compoundsCarbon Black1333-86-40.0128000.1000000.000994
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1152000.9000000.008946
PolymersPlastic: EP - Epoxide, Epoxy4.99200039.0000000.387666
Subtotal12.800000100.00000000.994015
Total1287.707000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LS1043AXE7PQB
Product content declaration of LS1043AXE7PQB
上次修订 Last Revision (GMT):
Thursday, 02 June 2022, 07:32:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LS1043AXE7PQBLast Revision (GMT):
Thursday, 02 June 2022, 07:32:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
4 Mar 2021
Test Report
4 Mar 2021
Test Report
4 Mar 2021
Test Report
4 Mar 2021
SubstrateAUS703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
CU FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
SOPTest Report
7 Sep 2021
Test Report
7 Sep 2021
Test Report
7 Sep 2021
Test Report
7 Sep 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.