LX2080XE72232B

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of LX2080XE72232BLast Revision (GMT):
Tuesday, 08 November 2022, 11:54:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LX2080XE72232BSOT1848BGA151720331.226000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 026 465572020-10-1563 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-715.62320040.0000000.076843
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-65.85870015.0000000.028816
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-217.57610045.0000000.086449
Subtotal39.058000100.00000000.192108
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-814014.11236099.90000068.929008
Miscellaneous substancesProprietary Material-Other miscellaneous substances.14.0281400.1000000.068998
Subtotal14028.140500100.000000068.998006
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.2208590.1000000.001086
Nickel and its compoundsNickel, metal7440-02-0220.63864199.9000001.085220
Subtotal220.859500100.00000001.086307
Semiconductor DieSemiconductor DieCopper and its compoundsCopper, metal7440-50-811.8221825.9811000.058148
Inorganic Silicon compoundsSilicon, doped180.51307091.3255000.887861
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.6217061.8323000.017813
Silver and its compoundsSilver, metal7440-22-40.0306370.0155000.000151
Tin and its compoundsTin, metal7440-31-51.6714040.8456000.008221
Subtotal197.659000100.00000000.972194
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-86.3638990.5009000.031301
Silver and its compoundsSilver, metal7440-22-438.1833973.0054000.187807
Tin and its compoundsTin, metal7440-31-51225.94570496.4937006.029866
Subtotal1270.493000100.00000006.248974
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-81810.63591899.9900008.905690
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1810820.0100000.000891
Subtotal1810.817000100.00000008.906581
Solder 1Copper and its compoundsCopper, metal7440-50-80.3075650.5000000.001513
Silver and its compoundsSilver, metal7440-22-41.8453903.0000000.009077
Tin and its compoundsTin, metal7440-31-559.36004596.5000000.291965
Subtotal61.513000100.00000000.302554
Solder 2Copper and its compoundsCopper, metal7440-50-80.0880040.7000000.000433
Tin and its compoundsTin, metal7440-31-512.48399699.3000000.061403
Subtotal12.572000100.00000000.061836
Solder MaskBarium and its compoundsBarium sulfate7727-43-719.83682023.5000000.097568
Inorganic Silicon compoundsSilica, vitreous60676-86-013.08386015.5000000.064353
Miscellaneous substancesProprietary Material-Other miscellaneous substances.4.2206005.0000000.020759
PolymersPlastic: EP - Epoxide, Epoxy47.27072056.0000000.232503
Subtotal84.412000100.00000000.415184
Substrate Build UpEpoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-622.9439005.0000000.112851
Inorganic Silicon compoundsSilicon dioxide7631-86-9298.27070065.0000001.467057
IsocyanatesProprietary Material-Other isocyanate compounds34.4158507.5000000.169276
Miscellaneous substancesProprietary Material-Other miscellaneous substances.11.4719502.5000000.056425
PolymersPlastic: EP - Epoxide, Epoxy91.77560020.0000000.451402
Subtotal458.878000100.00000002.257011
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3804.10512039.0000003.955025
Inorganic Silicon compoundsSilica, vitreous60676-86-0742.25088036.0000003.650793
PolymersPlastic: PI - Polyimide515.45200025.0000002.535273
Subtotal2061.808000100.000000010.141090
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-532.51160072.0000000.159910
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones4.51550010.0000000.022210
Zinc and its compoundsZinc oxide1314-13-28.12790018.0000000.039977
Subtotal45.155000100.00000000.222097
UnderfillUnderfillAromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.8370012.0998000.004117
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.3950153.4997000.006861
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.57283318.9981000.037247
Inorganic Silicon compoundsSilica, vitreous60676-86-026.70415966.9932000.131346
Inorganic compoundsCarbon Black1333-86-40.0318890.0800000.000157
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7333631.8398000.003607
Organic compoundsOther organic compounds.2.5110046.2994000.012351
Phosphorus compoundsTriphenyl phosphine603-35-00.0757360.1900000.000373
Subtotal39.861000100.00000000.196058
Total20331.226000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LX2080XE72232B
Product content declaration of LX2080XE72232B
上次修订 Last Revision (GMT):
Tuesday, 08 November 2022, 11:54:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LX2080XE72232BLast Revision (GMT):
Tuesday, 08 November 2022, 11:54:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Heat SpreaderCU ALLOYTest Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
NI PLATINGTest Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
23 Feb 2022
SubstrateABF-GZ41Test Report
20 Jun 2022
Test Report
20 Jun 2022
Test Report
20 Jun 2022
Test Report
20 Jun 2022
CU FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E705GTest Report
24 Mar 2022
Test Report
24 Mar 2022
Test Report
24 Mar 2022
Test Report
24 Mar 2022
LF204Test Report
8 Nov 2021
Test Report
8 Nov 2021
Test Report
8 Nov 2021
Test Report
8 Nov 2021
SR7300GRBTest Report
8 Feb 2022
Test Report
8 Feb 2022
Test Report
8 Feb 2022
Test Report
8 Feb 2022
THP-100DX1Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Thermally Conductive GelTest Report
3 Aug 2022
Test Report
3 Aug 2022
Test Report
3 Aug 2022
Test Report
3 Aug 2022
UnderfillTest Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
6 Apr 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.