LX2082RE82029B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LX2082RE82029BLast Revision (GMT):
Sunday, 17 September 2023, 07:57:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LX2082RE82029BSOT2055FBGA11507327.871000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 043 215572023-11-2493 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die Encapsulant 1Die EncapsulantAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-132.73340070.0000000.446697
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-214.02860030.0000000.191442
Subtotal46.762000100.00000000.638139
Die Encapsulant 2Die EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-255.01600013.0000000.750777
Inorganic Silicon compoundsSilicon dioxide7631-86-9253.92000060.0000003.465127
Inorganic compoundsCarbon Black1333-86-42.1160000.5000000.028876
PolymersPlastic: EP - Epoxide, Epoxy112.14800026.5000001.530431
Subtotal423.200000100.00000005.775211
Heat SpreaderBlack OxideBarium and its compoundsBarium sulfate7727-43-70.13616714.6500000.001858
Inorganic Silicon compoundsSilicon dioxide7631-86-90.13626014.6600000.001860
Inorganic compoundsCarbon Black1333-86-40.0203552.1900000.000278
Magnesium and its compoundsTalc14807-96-60.13616714.6500000.001858
PolymersPlastic: EP - Epoxide, Epoxy0.50052053.8500000.006830
Subtotal0.929471100.00000000.012684
Copper AlloyCopper and its compoundsCopper, metal7440-50-81802.24992099.99000024.594455
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1802430.0100000.002460
Subtotal1802.430163100.000000024.596915
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0055580.0100000.000076
Nickel and its compoundsNickel, metal7440-02-055.57680899.9900000.758431
Subtotal55.582366100.00000000.758506
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3193.70582098.0000002.643412
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.9531802.0000000.053947
Subtotal197.659000100.00000002.697359
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.3572350.5000000.018521
Silver and its compoundsSilver, metal7440-22-48.1434103.0000000.111129
Tin and its compoundsTin, metal7440-31-5261.94635596.5000003.574658
Subtotal271.447000100.00000003.704309
SubstrateCopper PlatingCopper and its compoundsCopper, metal7440-50-81548.44614099.99000021.130914
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1548600.0100000.002113
Subtotal1548.601000100.000000021.133028
SolderCopper and its compoundsCopper, metal7440-50-80.1760080.7000000.002402
Tin and its compoundsTin, metal7440-31-524.96799299.3000000.340726
Subtotal25.144000100.00000000.343128
Solder MaskBarium and its compoundsBarium sulfate7727-43-720.90544019.4000000.285287
Inorganic Silicon compoundsSilicon dioxide7631-86-910.77600010.0000000.147055
Magnesium and its compoundsTalc14807-96-63.2328003.0000000.044117
Organic compoundsOther organic compounds.5.9268005.5000000.080880
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.8620800.8000000.011764
PolymersPlastic: EP - Epoxide, Epoxy13.36224012.4000000.182348
PolymersPlastic: PAK52.69464048.9000000.719099
Subtotal107.760000100.00000001.470550
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-31097.20558555.50000014.973047
Inorganic Silicon compoundsSilicon dioxide7631-86-9409.22802920.7000005.584542
Miscellaneous substancesProprietary Material-Other miscellaneous substances.112.6859795.7000001.537772
PolymersPlastic: EP - Epoxide, Epoxy357.82740718.1000004.883102
Subtotal1976.947000100.000000026.978463
Substrate PrepregEpoxy ResinsBisphenol A diglycidyl ether1675-54-386.14837310.3600001.175626
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-586.14837310.3600001.175626
Inorganic Silicon compoundsSilicon dioxide7631-86-9387.83398746.6400005.292587
PolymersPlastic: EP - Epoxide, Epoxy271.41726732.6400003.703904
Subtotal831.548000100.000000011.347743
UnderfillUnderfillAromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.8370012.0998000.011422
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.3950153.4997000.019037
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.57283318.9981000.103343
Inorganic Silicon compoundsSilica, vitreous60676-86-026.70415966.9932000.364419
Inorganic compoundsCarbon Black1333-86-40.0318890.0800000.000435
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7333631.8398000.010008
Organic compoundsOther organic compounds.2.5110046.2994000.034266
Phosphorus compoundsTriphenyl phosphine603-35-00.0757360.1900000.001033
Subtotal39.861000100.00000000.543964
Total7327.871000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LX2082RE82029B
Product content declaration of LX2082RE82029B
上次修订 Last Revision (GMT):
Sunday, 17 September 2023, 07:57:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
散热片
Heat Spreader
氧化黑
Black Oxide
OOOOOO

铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
镀铜
Copper Plating
OOOOOO

焊料
Solder
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LX2082RE82029BLast Revision (GMT):
Sunday, 17 September 2023, 07:57:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die Encapsulant 1Test Report
28 Mar 2024
Test Report
28 Mar 2024
Test Report
28 Mar 2024
Test Report
28 Mar 2024
Die Encapsulant 2Test Report
11 Sep 2023
Test Report
11 Sep 2023
Test Report
11 Sep 2023
Test Report
11 Sep 2023
Heat SpreaderTest Report
28 Jan 2022
Test Report
28 Jan 2022
Test Report
28 Jan 2022
Test Report
28 Jan 2022
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateABF-GX92Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
AUS SR-1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CU FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Not AvailableTest Report
4 Jan 2024
CU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
HL832NSTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
PHP-900 IR-6Test Report
20 Apr 2023
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Not Available
UnderfillTest Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.