MC10XS3435BHFK
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| NXP Semiconductors | ||
| Product content declaration of MC10XS3435BHFK | Last Revision (GMT): Thursday, 26 October 2023, 08:35:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| MC10XS3435BHFK | SOT1631 | HQFN24 | 985.163382 mg | Yes | No | Yes | Other | Cu alloy | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9340 705 33557 | 2023-11-24 | 6 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | Tianjin, China |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Al | Bonding Wire - Al | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 12.899956 | 99.990000 | 1.309423 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.001290 | 0.010000 | 0.000131 | |||
| Subtotal | 12.901246 | 100.0000000 | 1.309554 | ||||
| Bonding Wire - CuPd | Bonding Wire - CuPd | Copper and its compounds | Copper, metal | 7440-50-8 | 1.121060 | 98.820000 | 0.113794 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.000908 | 0.080000 | 0.000092 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.012479 | 1.100000 | 0.001267 | ||
| Subtotal | 1.134446 | 100.0000000 | 0.115153 | ||||
| Copper Lead-Frame, Pre-Plated | Copper Lead-Frame, Pre-Plated | Copper and its compounds | Copper, metal | 7440-50-8 | 227.435270 | 97.227800 | 23.086046 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.070176 | 0.030000 | 0.007123 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 5.619226 | 2.402200 | 0.570385 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.444448 | 0.190000 | 0.045114 | ||
| Zirconium and its compounds | Zirconium, metal | 7440-67-7 | 0.350880 | 0.150000 | 0.035616 | ||
| Subtotal | 233.920000 | 100.0000000 | 23.744285 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 49.189000 | 7.000000 | 4.992979 | |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 579.727500 | 82.500000 | 58.845823 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 52.702500 | 7.500000 | 5.349620 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 3.513500 | 0.500000 | 0.356641 | ||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 17.567500 | 2.500000 | 1.783207 | |||
| Subtotal | 702.700000 | 100.0000000 | 71.328270 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.417900 | 9.950000 | 0.042419 | |
| Palladium and its compounds | Proprietary Material-Other palladium compounds | 0.002100 | 0.050000 | 0.000213 | |||
| Polymers | Amines, C36-alkylenedi-, maleated | 682800-79-9 | 0.420000 | 10.000000 | 0.042632 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 3.360000 | 80.000000 | 0.341060 | ||
| Subtotal | 4.200000 | 100.0000000 | 0.426325 | ||||
| Semiconductor Die 1 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 14.700000 | 98.000000 | 1.492138 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.300000 | 2.000000 | 0.030452 | |||
| Subtotal | 15.000000 | 100.0000000 | 1.522590 | ||||
| Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 7.553536 | 98.000000 | 0.766729 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.154154 | 2.000000 | 0.015648 | |||
| Subtotal | 7.707690 | 100.0000000 | 0.782377 | ||||
| Solder Paste 1 | Solder Paste | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 6.105000 | 92.500000 | 0.619694 |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.165000 | 2.500000 | 0.016748 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.330000 | 5.000000 | 0.033497 | ||
| Subtotal | 6.600000 | 100.0000000 | 0.669940 | ||||
| Solder Paste 2 | Solder Paste | Antimony and its compounds | Antimony, metal | 7440-36-0 | 0.000018 | 0.001800 | 0.000002 |
| Arsenic and its compounds | Arsenic, metal | 7440-38-2 | 0.000010 | 0.001000 | 0.000001 | ||
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.880026 | 88.002600 | 0.089328 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.019991 | 1.999100 | 0.002029 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.099955 | 9.995500 | 0.010146 | ||
| Subtotal | 1.000000 | 100.0000000 | 0.101506 | ||||
| Total | 985.163382 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 MC10XS3435BHFK Product content declaration of MC10XS3435BHFK | 上次修订 Last Revision (GMT): Thursday, 26 October 2023, 08:35:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-铝 Bonding Wire - Al | 焊丝-铝 Bonding Wire - Al | O | O | O | O | O | O |
| 焊丝-铜钯 Bonding Wire - CuPd | 焊丝-铜钯 Bonding Wire - CuPd | O | O | O | O | O | O |
| 铜引线框架，预镀 Copper Lead-Frame, Pre-Plated | 铜引线框架，预镀 Copper Lead-Frame, Pre-Plated | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 1 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 2 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 焊锡膏 Solder Paste 1 | 焊锡膏 Solder Paste | X | O | O | O | O | O |
| 焊锡膏 Solder Paste 2 | 焊锡膏 Solder Paste | X | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 |
| Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of MC10XS3435BHFK | Last Revision (GMT): Thursday, 26 October 2023, 08:35:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Al | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | |
| Bonding Wire - CuPd | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | |
| Copper Lead-Frame, Pre-Plated | AU PLATING | Test Report 16 Sep 2021 | Test Report 16 Sep 2021 | Test Report 16 Sep 2021 | Test Report 16 Sep 2021 |
| NI PLATING | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | |
| PD PLATING | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | Test Report 17 Sep 2021 | |
| Die Encapsulant | Test Report 19 Jul 2023 | Test Report 19 Jul 2023 | Test Report 19 Jul 2023 | Test Report 19 Jul 2023 | |
| Epoxy Adhesive | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | Test Report 1 Dec 2023 | |
| Semiconductor Die 1 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
| Semiconductor Die 2 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
| Solder Paste 1 | Not Available | Not Available | Not Available | Not Available | |
| Solder Paste 2 | Test Report 26 Jul 2021 | Test Report 26 Jul 2021 | Test Report 26 Jul 2021 | Test Report 26 Jul 2021 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |