MC15XS3400CHFKR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC15XS3400CHFKR2Last Revision (GMT):
Wednesday, 10 May 2023, 01:01:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC15XS3400CHFKR2SOT1631HQFN24927.435692 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 706 655282023-11-246Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-512.89995699.9900001.390927
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012900.0100000.000139
Subtotal12.901246100.00000001.391066
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.12106098.8200000.120877
Gold and its compoundsGold, metal7440-57-50.0009080.0800000.000098
Palladium and its compoundsPalladium, metal7440-05-30.0124791.1000000.001345
Subtotal1.134446100.00000000.122321
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8174.91281297.22780018.859832
Gold and its compoundsGold, metal7440-57-50.0539700.0300000.005819
Nickel and its compoundsNickel, metal7440-02-04.3215582.4022000.465969
Palladium and its compoundsPalladium, metal7440-05-30.3418100.1900000.036855
Zirconium and its compoundsZirconium, metal7440-67-70.2698500.1500000.029096
Subtotal179.900000100.000000019.397572
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins49.1890007.0000005.303764
Inorganic Silicon compoundsSilica, vitreous60676-86-0579.72750082.50000062.508647
Inorganic Silicon compoundsSilicon dioxide7631-86-952.7025007.5000005.682604
Inorganic compoundsCarbon Black1333-86-43.5135000.5000000.378840
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins17.5675002.5000001.894201
Subtotal702.700000100.000000075.768057
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.4179009.9500000.045060
Palladium and its compoundsProprietary Material-Other palladium compounds0.0021000.0500000.000226
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.42000010.0000000.045286
Silver and its compoundsSilver, metal7440-22-43.36000080.0000000.362289
Subtotal4.200000100.00000000.452862
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped14.70000098.0000001.585016
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3000002.0000000.032347
Subtotal15.000000100.00000001.617363
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped3.92000098.0000000.422671
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0800002.0000000.008626
Subtotal4.000000100.00000000.431297
Solder Paste 1Solder PasteLead and its compoundsLead, metallic lead and lead alloys7439-92-16.10500092.5000000.658267
Silver and its compoundsSilver, metal7440-22-40.1650002.5000000.017791
Tin and its compoundsTin, metal7440-31-50.3300005.0000000.035582
Subtotal6.600000100.00000000.711640
Solder Paste 2Solder PasteAntimony and its compoundsAntimony, metal7440-36-00.0000180.0018000.000002
Arsenic and its compoundsArsenic, metal7440-38-20.0000100.0010000.000001
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.88002688.0026000.094888
Silver and its compoundsSilver, metal7440-22-40.0199911.9991000.002155
Tin and its compoundsTin, metal7440-31-50.0999559.9955000.010778
Subtotal1.000000100.00000000.107824
Total927.435692100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC15XS3400CHFKR2
Product content declaration of MC15XS3400CHFKR2
上次修订 Last Revision (GMT):
Wednesday, 10 May 2023, 01:01:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste 1
焊锡膏
Solder Paste
XOOOOO
焊锡膏
Solder Paste 2
焊锡膏
Solder Paste
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC15XS3400CHFKR2Last Revision (GMT):
Wednesday, 10 May 2023, 01:01:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
NI PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
PD PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Die EncapsulantTest Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Epoxy AdhesiveTest Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Semiconductor Die 1Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 2Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Paste 1Not AvailableNot AvailableNot AvailableNot Available
Solder Paste 2Test Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.