MC33HB2000AESR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC33HB2000AESR2Last Revision (GMT):
Tuesday, 06 August 2024, 08:36:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC33HB2000AESR2SOT788-3(DD)HVQFN2864.456741 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 859 365282023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-81.13129297.8000001.755118
Gold and its compoundsGold, metal7440-57-50.0011570.1000000.001795
Palladium and its compoundsPalladium, metal7440-05-30.0242922.1000000.037687
Subtotal1.156740100.00000001.794599
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-83.56663496.3955005.533376
Iron and its compoundsIron, metal7439-89-60.0869502.3500000.134897
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0006290.0170000.000976
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0030530.0825000.004736
Silver and its compoundsSilver, metal7440-22-40.0370001.0000000.057403
Tin and its compoundsTin, metal7440-31-50.0011100.0300000.001722
Zinc and its compoundsZinc, metal7440-66-60.0046250.1250000.007175
Subtotal3.700000100.00000005.740284
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins0.8221201.5600001.275460
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.9182803.6400002.976074
Inorganic Silicon compoundsSilica, vitreous60676-86-041.42747178.61000064.271743
Inorganic Silicon compoundsSilicon dioxide7631-86-94.6059808.7400007.145847
Inorganic compoundsCarbon Black1333-86-40.0895900.1700000.138992
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.6389703.1100002.542744
Phenols and Phenolic ResinsOther phenolic resins0.1633700.3100000.253457
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-62.0342203.8600003.155946
Subtotal52.700001100.000000081.760263
Epoxy AdhesiveEpoxy AdhesiveMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0800008.0000000.124114
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.10000010.0000000.155143
Silver and its compoundsSilver, metal7440-22-40.82000082.0000001.272171
Subtotal1.000000100.00000001.551428
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0390003.0000000.060506
Nickel and its compoundsNickel, metal7440-02-01.19990092.3000001.861559
Palladium and its compoundsPalladium, metal7440-05-30.0403003.1000000.062523
Silver and its compoundsSilver, metal7440-22-40.0208001.6000000.032270
Subtotal1.300000100.00000002.016857
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped4.50800098.0000006.993838
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0920002.0000000.142731
Subtotal4.600000100.00000007.136569
Total64.456741100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC33HB2000AESR2
Product content declaration of MC33HB2000AESR2
上次修订 Last Revision (GMT):
Tuesday, 06 August 2024, 08:36:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC33HB2000AESR2Last Revision (GMT):
Tuesday, 06 August 2024, 08:36:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuNot AvailableNot AvailableNot AvailableNot Available
Copper Lead-Frame, Pre-Plated NiPdAuAG PLATINGNot AvailableNot AvailableNot AvailableNot Available
AU PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
CDA 194Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
NI PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
PD PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
24 Sep 2021
Test Report
24 Sep 2021
Test Report
24 Sep 2021
Test Report
24 Sep 2021
Pre-plating - Precious metal - OtherTest Report
1 Jan 2024
Test Report
1 Jan 2024
Test Report
1 Jan 2024
Not Available
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.