MC33HB2000FKR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC33HB2000FKR2Last Revision (GMT):
Thursday, 07 December 2023, 09:48:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC33HB2000FKR2SOT1633-1HQFN32371.408638 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 126 645642023-11-248Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kaohsiung, Taiwan;Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.63707698.7000000.440775
Palladium and its compoundsPalladium, metal7440-05-30.0215621.3000000.005805
Subtotal1.658638100.00000000.446580
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-812.29585495.3167003.310600
Gold and its compoundsGold, metal7440-57-50.0036770.0285000.000990
Iron and its compoundsIron, metal7439-89-60.2978872.3092000.080205
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0021540.0167000.000580
Nickel and its compoundsNickel, metal7440-02-00.2573291.9948000.069285
Palladium and its compoundsPalladium, metal7440-05-30.0272580.2113000.007339
Zinc and its compoundsZinc, metal7440-66-60.0158410.1228000.004265
Subtotal12.900000100.00000003.473263
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-84.26563099.9000001.148500
Zirconium and its compoundsZirconium, metal7440-67-70.0042700.1000000.001150
Subtotal4.269900100.00000001.149650
Gold PlatingGold and its compoundsGold, metal7440-57-50.00387099.9900000.001042
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.003871100.00000000.001042
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.01375799.9900000.003704
Subtotal0.013759100.00000000.003704
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Palladium and its compoundsPalladium, metal7440-05-30.01246999.9900000.003357
Subtotal0.012470100.00000000.003358
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins18.8790007.0000005.083081
Inorganic Silicon compoundsSilica, vitreous60676-86-0222.50250082.50000059.907734
Inorganic Silicon compoundsSilicon dioxide7631-86-920.2275007.5000005.446158
Inorganic compoundsCarbon Black1333-86-41.3485000.5000000.363077
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins6.7425002.5000001.815386
Subtotal269.700000100.000000072.615436
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped4.11600098.0000001.108213
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0840002.0000000.022617
Subtotal4.200000100.00000001.130830
Solder PasteSolder PasteAntimony and its compoundsAntimony, metal7440-36-00.0014160.0018000.000381
Arsenic and its compoundsArsenic, metal7440-38-20.0007860.0010000.000212
Lead and its compoundsLead, metallic lead and lead alloys7439-92-169.21404588.00260018.635551
Silver and its compoundsSilver, metal7440-22-41.5722921.9991000.423332
Tin and its compoundsTin, metal7440-31-57.8614619.9955002.116661
Subtotal78.650000100.000000021.176136
Total371.408638100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC33HB2000FKR2
Product content declaration of MC33HB2000FKR2
上次修订 Last Revision (GMT):
Thursday, 07 December 2023, 09:48:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC33HB2000FKR2Last Revision (GMT):
Thursday, 07 December 2023, 09:48:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
CDA 194Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
NI PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
PD PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder PasteTest Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.