MC33HB2001EK

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MC33HB2001EKLast Revision (GMT):
Wednesday, 06 March 2024, 08:11:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC33HB2001EKSOT1746-1HSOP32490.240806 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 181 125742023-11-2453 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-81.04838297.0000000.213850
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0324243.0000000.006614
Subtotal1.080806100.00000000.220464
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-8126.81239797.29100025.867369
Iron and its compoundsIron, metal7439-89-63.0891392.3700000.630127
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0221580.0170000.004520
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2163700.1660000.044136
Tin and its compoundsTin, metal7440-31-50.0391030.0300000.007976
Zinc and its compoundsZinc, metal7440-66-60.1642330.1260000.033500
Subtotal130.343400100.000000026.587628
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001320.0100000.000027
Silver and its compoundsSilver, metal7440-22-41.31646899.9900000.268535
Subtotal1.316600100.00000000.268562
Die EncapsulantDie EncapsulantEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-210.2690003.0000002.094685
Epoxy ResinsProprietary Material-Other Epoxy resins10.2690003.0000002.094685
Inorganic Silicon compoundsSilica, vitreous60676-86-0299.51250087.50000061.094975
Inorganic Silicon compoundsSilicon dioxide7631-86-910.2690003.0000002.094685
Inorganic compoundsCarbon Black1333-86-41.7115000.5000000.349114
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins10.2690003.0000002.094685
Subtotal342.300000100.000000069.822829
Epoxy AdhesiveEpoxy AdhesiveCyanide compoundsPolymethylene polyphenyl isocyanate (PAPI)9016-87-90.0091800.5100000.001873
Epoxy ResinsOther Non-halogenated Epoxy resins0.0784084.3560000.015994
Organic Tin compounds - SpecificDibutyltin dilaurate77-58-70.0006120.0340000.000125
Organic compoundsAlkanes, C14-1690622-46-10.25200014.0000000.051403
Polymers1,3-Benzenedicarboxylic acid, polymer with 1,4-benzenedicarboxylic acid, 1,4-butanediol and hexanedioic acid66027-02-90.0918005.1000000.018725
Silver and its compoundsSilver, metal7440-22-41.36800076.0000000.279046
Subtotal1.800000100.00000000.367166
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0018400.0200000.000375
Tin and its compoundsTin, metal7440-31-59.19816099.9800001.876253
Subtotal9.200000100.00000001.876629
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped4.11600098.0000000.839587
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0840002.0000000.017134
Subtotal4.200000100.00000000.856722
Total490.240806100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC33HB2001EK
Product content declaration of MC33HB2001EK
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 08:11:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC33HB2001EKLast Revision (GMT):
Wednesday, 06 March 2024, 08:11:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Copper Lead-FrameAG PLATINGTest Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
CDA 194Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Die EncapsulantTest Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Epoxy AdhesiveTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.