MC35XS3500DHFK

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC35XS3500DHFKLast Revision (GMT):
Tuesday, 18 July 2023, 07:42:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC35XS3500DHFKSOT1631HQFN24952.559302 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 705 415572023-11-246Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-512.89995699.9900001.354242
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012900.0100000.000135
Subtotal12.901246100.00000001.354377
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.12106098.8200000.117689
Gold and its compoundsGold, metal7440-57-50.0009080.0800000.000095
Palladium and its compoundsPalladium, metal7440-05-30.0124791.1000000.001310
Subtotal1.134446100.00000000.119095
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8205.16281297.22780021.538062
Gold and its compoundsGold, metal7440-57-50.0633040.0300000.006646
Nickel and its compoundsNickel, metal7440-02-05.0689422.4022000.532139
Palladium and its compoundsPalladium, metal7440-05-30.4009240.1900000.042089
Zirconium and its compoundsZirconium, metal7440-67-70.3165190.1500000.033228
Subtotal211.012500100.000000022.152164
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins49.1890007.0000005.163878
Inorganic Silicon compoundsSilica, vitreous60676-86-0579.72750082.50000060.859990
Inorganic Silicon compoundsSilicon dioxide7631-86-952.7025007.5000005.532726
Inorganic compoundsCarbon Black1333-86-43.5135000.5000000.368848
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins17.5675002.5000001.844242
Subtotal702.700000100.000000073.769685
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.4179009.9500000.043871
Palladium and its compoundsProprietary Material-Other palladium compounds0.0021000.0500000.000220
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.42000010.0000000.044092
Silver and its compoundsSilver, metal7440-22-43.36000080.0000000.352734
Subtotal4.200000100.00000000.440917
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped8.83088898.0000000.927070
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1802222.0000000.018920
Subtotal9.011110100.00000000.945989
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped3.92000098.0000000.411523
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0800002.0000000.008398
Subtotal4.000000100.00000000.419921
Solder Paste 1Solder PasteLead and its compoundsLead, metallic lead and lead alloys7439-92-16.10500092.5000000.640905
Silver and its compoundsSilver, metal7440-22-40.1650002.5000000.017322
Tin and its compoundsTin, metal7440-31-50.3300005.0000000.034644
Subtotal6.600000100.00000000.692870
Solder Paste 2Solder PasteAntimony and its compoundsAntimony, metal7440-36-00.0000180.0018000.000002
Arsenic and its compoundsArsenic, metal7440-38-20.0000100.0010000.000001
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.88002688.0026000.092385
Silver and its compoundsSilver, metal7440-22-40.0199911.9991000.002099
Tin and its compoundsTin, metal7440-31-50.0999559.9955000.010493
Subtotal1.000000100.00000000.104980
Total952.559302100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC35XS3500DHFK
Product content declaration of MC35XS3500DHFK
上次修订 Last Revision (GMT):
Tuesday, 18 July 2023, 07:42:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste 1
焊锡膏
Solder Paste
XOOOOO
焊锡膏
Solder Paste 2
焊锡膏
Solder Paste
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC35XS3500DHFKLast Revision (GMT):
Tuesday, 18 July 2023, 07:42:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
NI PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
PD PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Die EncapsulantTest Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Epoxy AdhesiveTest Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Paste 1Not AvailableNot AvailableNot AvailableNot Available
Solder Paste 2Test Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.