MC68360CVR25L

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC68360CVR25LLast Revision (GMT):
Tuesday, 07 May 2024, 07:24:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC68360CVR25LSOT1666-1BGA3572141.782291 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 239 265572024-04-02123 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-520.67584399.9900000.965357
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0020680.0100000.000097
Subtotal20.677911100.00000000.965453
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins46.9500006.0000002.192100
Inorganic Silicon compoundsSilica, vitreous60676-86-0579.05000074.00000027.035895
Inorganic Silicon compoundsSilicon dioxide7631-86-9117.37500015.0000005.480249
Inorganic compoundsCarbon Black1333-86-43.9125000.5000000.182675
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-415.6500002.0000000.730700
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins19.5625002.5000000.913375
Subtotal782.500000100.000000036.534993
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.79200012.0000000.036978
Epoxy ResinsProprietary Material-Other Epoxy resins0.4620007.0000000.021571
Silver and its compoundsSilver, metal7440-22-45.34600081.0000000.249605
Subtotal6.600000100.00000000.308154
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped51.97957298.0000002.426931
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0608082.0000000.049529
Subtotal53.040380100.00000002.476460
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0061550.0010000.000287
Arsenic and its compoundsArsenic, metal7440-38-20.0061550.0010000.000287
Bismuth and its compoundsBismuth, metal7440-69-90.0061550.0010000.000287
Copper and its compoundsCopper, metal7440-50-84.3082480.7000000.201153
Iron and its compoundsIron, metal7439-89-60.0110780.0018000.000517
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0344660.0056000.001609
Silver and its compoundsSilver, metal7440-22-423.1414463.7600001.080476
Tin and its compoundsTin, metal7440-31-5587.95029795.52960027.451450
Subtotal615.464000100.000000028.736067
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8217.87161199.99000010.172444
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0217890.0100000.001017
Subtotal217.893400100.000000010.173462
Copper PlatingCopper and its compoundsCopper, metal7440-50-883.51794399.9800003.899460
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0167070.0200000.000780
Subtotal83.534650100.00000003.900240
Gold PlatingGold and its compoundsGold, metal7440-57-51.99030199.9900000.092927
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001990.0100000.000009
Subtotal1.990500100.00000000.092937
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0038020.0300000.000178
Nickel and its compoundsNickel, metal7440-02-012.66904899.9700000.591519
Subtotal12.672850100.00000000.591696
Solder MaskBarium and its compoundsBarium sulfate7727-43-750.03519834.2000002.336148
Inorganic Silicon compoundsSilicon dioxide7631-86-92.3408281.6000000.109294
Non-Halogenated Organic Compounds - Specific2-Methyl-4'-(methylthio)-2-morpholino propiophenone71868-10-50.1463020.1000000.006831
Organic compoundsOther organic compounds.5.4131653.7000000.252741
PolymersPlastic: EP - Epoxide, Epoxy23.70088316.2000001.106596
PolymersPlastic: PAK64.66537344.2000003.019232
Subtotal146.301750100.00000006.830841
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-395.76527247.6191004.471289
Inorganic Silicon compoundsSilica, vitreous60676-86-09.5765074.7619000.447128
PolymersPlastic: PI - Polyimide95.76507147.6190004.471279
Subtotal201.106850100.00000009.389696
Total2141.782291100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC68360CVR25L
Product content declaration of MC68360CVR25L
上次修订 Last Revision (GMT):
Tuesday, 07 May 2024, 07:24:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC68360CVR25LLast Revision (GMT):
Tuesday, 07 May 2024, 07:24:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - SAC, Lead FreeTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Substrate, Pre-plated NiAuCOPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.