MC7457VG1267LC

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC7457VG1267LCLast Revision (GMT):
Monday, 25 December 2023, 07:16:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC7457VG1267LCSOT1608-1CFBGA4832214.700000 mg YesNoYesOtherNot Applicablee1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 239 711572023-11-2410Not ApplicableNot ApplicableNot Applicable1 / Unlimited26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped176.95260089.1000007.989913
Lead and its compoundsLead, metallic lead and lead alloys7439-92-118.7035529.4177000.844518
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.7874000.9000000.080706
Nickel and its compoundsNickel, metal7440-02-00.1638450.0825000.007398
Tin and its compoundsTin, metal7440-31-50.9842620.4956000.044442
Titanium and its compoundsTitanium, metal7440-32-60.0083410.0042000.000377
Subtotal198.600000100.00000008.967355
Solder Ball - SAC, Polymer CoreSolder Ball - SAC, Polymer CoreCopper and its compoundsCopper, metal7440-50-8595.65105630.83080026.895338
Nickel and its compoundsNickel, metal7440-02-07.7357280.4004000.349290
PolymersDivinylbenzene9003-69-4495.08659225.62560022.354567
Silver and its compoundsSilver, metal7440-22-429.0089801.5015001.309838
Tin and its compoundsTin, metal7440-31-5804.51764441.64170036.326258
Subtotal1932.000000100.000000087.235291
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.3145100.7000000.014201
Silver and its compoundsSilver, metal7440-22-41.7073403.8000000.077091
Tin and its compoundsTin, metal7440-31-542.90815095.5000001.937425
Subtotal44.930000100.00000002.028717
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines1.1751003.0000000.053059
Epoxy Resins(Chloromethyl)oxirane,homopolymer61788-97-411.35930029.0000000.512905
Inorganic Silicon compoundsSilica, vitreous60676-86-013.31780034.0000000.601337
Inorganic Silicon compoundsSilicon dioxide7631-86-913.31780034.0000000.601337
Subtotal39.170000100.00000001.768637
Total2214.700000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC7457VG1267LC
Product content declaration of MC7457VG1267LC
上次修订 Last Revision (GMT):
Monday, 25 December 2023, 07:16:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-聚合物内核
Solder Ball - SAC, Polymer Core
焊锡球-聚合物内核
Solder Ball - SAC, Polymer Core
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC7457VG1267LCLast Revision (GMT):
Monday, 25 December 2023, 07:16:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Solder Ball - SAC, Polymer CoreNot AvailableNot AvailableNot AvailableNot Available
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.