MC8610TPX1066JB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of MC8610TPX1066JBLast Revision (GMT):
Thursday, 07 March 2024, 11:40:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC8610TPX1066JBSOT1622-2BGA7833509.447000 mg NoNoNoTin/Lead (Sn63/Pb37)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 254 495572024-02-0610Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-752.16565665.4000001.486435
Copper and its compoundsCopper, metal7440-50-811.00743213.8000000.313652
Nickel and its compoundsNickel, metal7440-02-015.55398019.5000000.443203
Tin and its compoundsTin, metal7440-31-51.0369321.3000000.029547
Subtotal79.764000100.00000002.272837
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped308.55330089.1000008.792077
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.6134959.4177000.929306
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1167000.9000000.088809
Nickel and its compoundsNickel, metal7440-02-00.2856970.0825000.008141
Tin and its compoundsTin, metal7440-31-51.7162630.4956000.048904
Titanium and its compoundsTitanium, metal7440-32-60.0145450.0042000.000414
Subtotal346.300000100.00000009.867651
Solder Ball - Low LeadSolder Ball - Low LeadCopper and its compoundsCopper, metal7440-50-80.1352410.0300000.003854
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1166.57170836.9500004.746380
Silver and its compoundsSilver, metal7440-22-40.0901610.0200000.002569
Tin and its compoundsTin, metal7440-31-5284.00589063.0000008.092611
Subtotal450.803000100.000000012.845414
Solder FluxSolder FluxAliphatic AminesOther aliphatic amines0.0136080.2100000.000388
Aluminum and its compoundsAluminum, metal7429-90-50.0000650.0010000.000002
Antimony and its compoundsAntimony, metal7440-36-00.0064800.1000000.000185
Arsenic and its compoundsArsenic, metal7440-38-20.0006420.0099000.000018
Bismuth and its compoundsBismuth, metal7440-69-90.0019440.0300000.000055
Cadmium and its compoundsCadmium, metal7440-43-90.0001300.0020000.000004
Copper and its compoundsCopper, metal7440-50-80.0316870.4890000.000903
Gold and its compoundsGold, metal7440-57-50.0003240.0050000.000009
Iron and its compoundsIron, metal7439-89-60.0012960.0200000.000037
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0032400.0500000.000092
Nickel and its compoundsNickel, metal7440-02-00.0006480.0100000.000018
Silver and its compoundsSilver, metal7440-22-40.1739882.6850000.004958
Tin and its compoundsTin, metal7440-31-56.24458296.3670000.177936
Zinc and its compoundsZinc, metal7440-66-60.0013670.0211000.000039
Subtotal6.480000100.00000000.184644
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2395.17401615.41060011.260293
Arsenic and its compoundsArsenic, metal7440-38-20.0256430.0010000.000731
Barium and its compoundsBarium sulfate7727-43-710.4315720.4068000.297243
Copper and its compoundsCopper phthalocyanine147-14-81.6693590.0651000.047568
Copper and its compoundsCopper, metal7440-50-8891.39170934.76160025.399777
Epoxy ResinsBisphenol A diglycidyl ether1675-54-325.7455721.0040000.733608
Epoxy ResinsOther Epoxy resins39.3696981.5353001.121821
Epoxy ResinsProprietary Material-Other Epoxy resins105.3799084.1095003.002750
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3724.48398628.25270020.643822
Inorganic Silicon compoundsSilicon dioxide7631-86-9237.0618429.2447006.754963
Lead and its compoundsLead, metallic lead and lead alloys7439-92-11.9898970.0776000.056701
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-636.5746111.4263001.042176
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins70.8669952.7636002.019321
Silver and its compoundsSilver, metal7440-22-40.6256890.0244000.017829
Tin and its compoundsTin, metal7440-31-523.5095020.9168000.669892
Subtotal2564.300000100.000000073.068492
UnderfillUnderfillBismuth and its compoundsBismuth, metal7440-69-90.7416621.2001000.021133
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-512.36086520.0014000.352217
Inorganic Silicon compoundsSilica, vitreous60676-86-026.26500042.5000000.748409
Inorganic compoundsCarbon Black1333-86-40.6180621.0001000.017611
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-63.0902475.0004000.088055
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins18.72416430.2980000.533536
Subtotal61.800000100.00000001.760961
Total3509.447000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC8610TPX1066JB
Product content declaration of MC8610TPX1066JB
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 11:40:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC8610TPX1066JBLast Revision (GMT):
Thursday, 07 March 2024, 11:40:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadTest Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
Test Report
26 Jul 2021
Solder FluxTest Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
SubstrateABF-GX13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
AUS 703Test Report
22 Jan 2021
Test Report
22 Jan 2021
Test Report
22 Jan 2021
Test Report
22 Jan 2021
COPPERTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
Test Report
14 Jan 2020
E679FGBTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
LF SOLDERTest Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
2 Apr 2018
PH900 IR-6Not AvailableNot AvailableTest Report
16 Jul 2020
Not Available
PHP-900 IR-6Test Report
18 Jun 2021
Not AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.