MC8610VT800GB

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NXP Semiconductors
Product content declaration of MC8610VT800GBLast Revision (GMT):
Wednesday, 06 March 2024, 07:22:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC8610VT800GBSOT1622-2BGA7833438.792000 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 213 245572024-02-069Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-752.16565665.4000001.516976
Copper and its compoundsCopper, metal7440-50-811.00743213.8000000.320096
Nickel and its compoundsNickel, metal7440-02-015.55398019.5000000.452309
Tin and its compoundsTin, metal7440-31-51.0369321.3000000.030154
Subtotal79.764000100.00000002.319536
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped308.55330089.1000008.972724
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.6134959.4177000.948400
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1167000.9000000.090634
Nickel and its compoundsNickel, metal7440-02-00.2856970.0825000.008308
Tin and its compoundsTin, metal7440-31-51.7162630.4956000.049909
Titanium and its compoundsTitanium, metal7440-32-60.0145450.0042000.000423
Subtotal346.300000100.000000010.070397
Solder Ball - Lead FreeSolder Ball - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.3611220.0950000.010501
Arsenic and its compoundsArsenic, metal7440-38-20.1140380.0300000.003316
Bismuth and its compoundsBismuth, metal7440-69-90.1520510.0400000.004422
Iron and its compoundsIron, metal7439-89-60.1330450.0350000.003869
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1178400.0310000.003427
Silver and its compoundsSilver, metal7440-22-413.1866403.4690000.383467
Tin and its compoundsTin, metal7440-31-5366.06326496.30000010.645112
Subtotal380.128000100.000000011.054114
Solder FluxSolder FluxAliphatic AminesOther aliphatic amines0.0136500.2100000.000397
Aluminum and its compoundsAluminum, metal7429-90-50.0000650.0010000.000002
Antimony and its compoundsAntimony, metal7440-36-00.0065000.1000000.000189
Arsenic and its compoundsArsenic, metal7440-38-20.0006430.0099000.000019
Bismuth and its compoundsBismuth, metal7440-69-90.0019500.0300000.000057
Cadmium and its compoundsCadmium, metal7440-43-90.0001300.0020000.000004
Copper and its compoundsCopper, metal7440-50-80.0317850.4890000.000924
Gold and its compoundsGold, metal7440-57-50.0003250.0050000.000010
Iron and its compoundsIron, metal7439-89-60.0013000.0200000.000038
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0032500.0500000.000095
Nickel and its compoundsNickel, metal7440-02-00.0006500.0100000.000019
Silver and its compoundsSilver, metal7440-22-40.1745252.6850000.005075
Tin and its compoundsTin, metal7440-31-56.26385596.3670000.182153
Zinc and its compoundsZinc, metal7440-66-60.0013720.0211000.000040
Subtotal6.500000100.00000000.189020
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2395.17401615.41060011.491652
Arsenic and its compoundsArsenic, metal7440-38-20.0256430.0010000.000746
Barium and its compoundsBarium sulfate7727-43-710.4315720.4068000.303350
Copper and its compoundsCopper phthalocyanine147-14-81.6693590.0651000.048545
Copper and its compoundsCopper, metal7440-50-8891.39170934.76160025.921652
Epoxy ResinsBisphenol A diglycidyl ether1675-54-325.7455721.0040000.748681
Epoxy ResinsOther Epoxy resins39.3696981.5353001.144870
Epoxy ResinsProprietary Material-Other Epoxy resins105.3799084.1095003.064446
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3724.48398628.25270021.067979
Inorganic Silicon compoundsSilicon dioxide7631-86-9237.0618429.2447006.893753
Lead and its compoundsLead, metallic lead and lead alloys7439-92-11.9898970.0776000.057866
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-636.5746111.4263001.063589
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins70.8669952.7636002.060811
Silver and its compoundsSilver, metal7440-22-40.6256890.0244000.018195
Tin and its compoundsTin, metal7440-31-523.5095020.9168000.683656
Subtotal2564.300000100.000000074.569791
UnderfillUnderfillBismuth and its compoundsBismuth, metal7440-69-90.7416621.2001000.021567
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-512.36086520.0014000.359454
Inorganic Silicon compoundsSilica, vitreous60676-86-026.26500042.5000000.763786
Inorganic compoundsCarbon Black1333-86-40.6180621.0001000.017973
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-63.0902475.0004000.089864
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins18.72416430.2980000.544498
Subtotal61.800000100.00000001.797143
Total3438.792000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC8610VT800GB
Product content declaration of MC8610VT800GB
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 07:22:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC8610VT800GBLast Revision (GMT):
Wednesday, 06 March 2024, 07:22:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Solder FluxTest Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
SubstrateABF-GX13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
AUS 703Test Report
22 Jan 2021
Test Report
22 Jan 2021
Test Report
22 Jan 2021
Test Report
22 Jan 2021
COPPERTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
Test Report
14 Jan 2020
E679FGBTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
LF SOLDERTest Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
2 Apr 2018
PH900 IR-6Not AvailableNot AvailableTest Report
16 Jul 2020
Not Available
PHP-900 IR-6Test Report
18 Jun 2021
Not AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.