MC9328MX21SCVK

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NXP Semiconductors
Product content declaration of MC9328MX21SCVKLast Revision (GMT):
Tuesday, 28 June 2022, 06:58:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC9328MX21SCVKSOT1537-1LFBGA289332.168187 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Not Applicablee1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 135 855572020-10-1593 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.33165798.1000000.701951
Gold and its compoundsGold, metal7440-57-50.0023770.1000000.000715
Palladium and its compoundsPalladium, metal7440-05-30.0427831.8000000.012880
Subtotal2.376817100.00000000.715546
Die EncapsulantDie EncapsulantAluminum and its compoundsOther aluminum compounds7.9740003.0000002.400591
Epoxy ResinsOther Non-halogenated Epoxy resins13.2900005.0000004.000985
Inorganic Silicon compoundsSilica, vitreous60676-86-0225.93000085.00000068.016748
Inorganic compoundsCarbon Black1333-86-42.6580001.0000000.800197
Phenols and Phenolic ResinsOther phenolic resins7.9740003.0000002.400591
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-47.9740003.0000002.400591
Subtotal265.800000100.000000080.019704
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.08000045.0000000.325136
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002400.0100000.000072
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1200005.0000000.036126
PolymersPlastic: EP - Epoxide, Epoxy1.19976049.9900000.361191
Subtotal2.400000100.00000000.722526
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped21.20952398.0000006.385176
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4328472.0000000.130310
Subtotal21.642370100.00000006.515485
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0012380.0031000.000373
Antimony and its compoundsAntimony, metal7440-36-00.0049940.0125000.001503
Arsenic and its compoundsArsenic, metal7440-38-20.0024770.0062000.000746
Bismuth and its compoundsBismuth, metal7440-69-90.0075100.0188000.002261
Cadmium and its compoundsCadmium, metal7440-43-90.0004790.0012000.000144
Copper and its compoundsCopper, metal7440-50-80.1997450.5000000.060134
Gold and its compoundsGold, metal7440-57-50.0024770.0062000.000746
Indium and its compoundsIndium, metal7440-74-60.0024770.0062000.000746
Inorganic compoundsSulfur7704-34-90.0004000.0010000.000120
Iron and its compoundsIron, metal7439-89-60.0049940.0125000.001503
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0125440.0314000.003776
Nickel and its compoundsNickel, metal7440-02-00.0012380.0031000.000373
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0024770.0062000.000746
Silver and its compoundsSilver, metal7440-22-40.3994500.9999000.120255
Tin and its compoundsTin, metal7440-31-539.30574198.38980011.833084
Zinc and its compoundsZinc, metal7440-66-60.0007590.0019000.000228
Subtotal39.949000100.000000012.026739
Total332.168187100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC9328MX21SCVK
Product content declaration of MC9328MX21SCVK
上次修订 Last Revision (GMT):
Tuesday, 28 June 2022, 06:58:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC9328MX21SCVKLast Revision (GMT):
Tuesday, 28 June 2022, 06:58:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Semiconductor DieTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Solder Ball - SAC, Lead FreeTest Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.