MC9328MX21SVK

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NXP Semiconductors
Product content declaration of MC9328MX21SVKLast Revision (GMT):
Monday, 19 September 2022, 09:51:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC9328MX21SVKSOT1537-1LFBGA289490.368187 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 093 865572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.33165798.1000000.475491
Gold and its compoundsGold, metal7440-57-50.0023770.1000000.000485
Palladium and its compoundsPalladium, metal7440-05-30.0427831.8000000.008725
Subtotal2.376817100.00000000.484700
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins15.9480006.0000003.252250
Inorganic Silicon compoundsSilica, vitreous60676-86-0196.69200074.00000040.111085
Inorganic Silicon compoundsSilicon dioxide7631-86-939.87000015.0000008.130625
Inorganic compoundsCarbon Black1333-86-41.3290000.5000000.271021
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-45.3160002.0000001.084083
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins6.6450002.5000001.355104
Subtotal265.800000100.000000054.204169
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.08000045.0000000.220243
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002400.0100000.000049
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1200005.0000000.024471
PolymersPlastic: EP - Epoxide, Epoxy1.19976049.9900000.244665
Subtotal2.400000100.00000000.489428
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped21.20952398.0000004.325224
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4328472.0000000.088270
Subtotal21.642370100.00000004.413494
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0012380.0031000.000253
Antimony and its compoundsAntimony, metal7440-36-00.0049940.0125000.001018
Arsenic and its compoundsArsenic, metal7440-38-20.0024770.0062000.000505
Bismuth and its compoundsBismuth, metal7440-69-90.0075100.0188000.001532
Cadmium and its compoundsCadmium, metal7440-43-90.0004790.0012000.000098
Copper and its compoundsCopper, metal7440-50-80.1997450.5000000.040734
Gold and its compoundsGold, metal7440-57-50.0024770.0062000.000505
Indium and its compoundsIndium, metal7440-74-60.0024770.0062000.000505
Inorganic compoundsSulfur7704-34-90.0004000.0010000.000082
Iron and its compoundsIron, metal7439-89-60.0049940.0125000.001018
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0125440.0314000.002558
Nickel and its compoundsNickel, metal7440-02-00.0012380.0031000.000253
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0024770.0062000.000505
Silver and its compoundsSilver, metal7440-22-40.3994500.9999000.081459
Tin and its compoundsTin, metal7440-31-539.30574198.3898008.015557
Zinc and its compoundsZinc, metal7440-66-60.0007590.0019000.000155
Subtotal39.949000100.00000008.146736
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-850.16020499.99000010.229090
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0050170.0100000.001023
Subtotal50.165220100.000000010.230113
Copper PlatingCopper and its compoundsCopper, metal7440-50-839.93751199.9800008.144393
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0079890.0200000.001629
Subtotal39.945500100.00000008.146022
Gold PlatingGold and its compoundsGold, metal7440-57-50.58528299.9900000.119356
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000580.0100000.000012
Subtotal0.585340100.00000000.119367
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0011010.0300000.000225
Nickel and its compoundsNickel, metal7440-02-03.66913999.9700000.748242
Subtotal3.670240100.00000000.748466
Solder MaskBarium and its compoundsBarium sulfate7727-43-76.70287129.1000001.366906
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1382040.6000000.028184
Magnesium and its compoundsTalc14807-96-60.6910183.0000000.140918
Organic compoundsOther organic compounds.0.8292213.6000000.169102
PolymersPlastic: EP - Epoxide, Epoxy4.51464819.6000000.920665
PolymersPlastic: PAK10.15795944.1000002.071496
Subtotal23.033920100.00000004.697270
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-315.98461546.6700003.259717
Inorganic Silicon compoundsSilica, vitreous60676-86-02.2810706.6600000.465175
PolymersPlastic: PI - Polyimide15.98461546.6700003.259717
Subtotal34.250300100.00000006.984609
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-33.05664246.6700000.623336
Inorganic Silicon compoundsSilica, vitreous60676-86-00.4361956.6600000.088953
PolymersPlastic: PI - Polyimide3.05664246.6700000.623336
Subtotal6.549480100.00000001.335625
Total490.368187100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC9328MX21SVK
Product content declaration of MC9328MX21SVK
上次修订 Last Revision (GMT):
Monday, 19 September 2022, 09:51:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC9328MX21SVKLast Revision (GMT):
Monday, 19 September 2022, 09:51:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
SubstrateAUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.