MC9S08RX32AFE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC9S08RX32AFELast Revision (GMT):
Thursday, 12 May 2022, 02:05:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC9S08RX32AFESOT804-6HVQFN64194.782873 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 240 385572020-04-1623 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3NA
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-55.24901899.9900002.694805
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005250.0100000.000269
Subtotal5.249543100.00000002.695074
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-859.48652997.51890030.539918
Gold and its compoundsGold, metal7440-57-50.0215940.0354000.011086
Nickel and its compoundsNickel, metal7440-02-01.3625572.2337000.699526
Palladium and its compoundsPalladium, metal7440-05-30.1293200.2120000.066392
Subtotal61.000000100.000000031.316922
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins3.9390623.6072002.022284
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.6881231.5459000.866669
Inorganic Silicon compoundsSilica, vitreous60676-86-093.23572485.38070047.866490
Inorganic compoundsCarbon Black1333-86-40.1986350.1819000.101977
Magnesium and its compoundsMagnesium dihydroxide1309-42-83.9170043.5870002.010959
Organic Phosphorus compoundsOther organic phosphorous compounds0.0865960.0793000.044457
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-80.3451810.3161000.177213
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-63.9690923.6347002.037701
Zinc and its compoundsZinc Hydroxide20427-58-11.8205821.6672000.934673
Subtotal109.200000100.000000056.062424
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0463323.3094000.023786
AcrylatesProprietary Material-Other acrylates0.1235538.8252000.063431
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0463323.3094000.023786
Palladium and its compoundsPalladium, metal7440-05-30.0023170.1655000.001190
PolymersProprietary Material-Other polymers0.0231661.6547000.011893
Silver and its compoundsSilver, metal7440-22-41.15830182.7358000.594663
Subtotal1.400000100.00000000.718749
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped7.48066398.0000003.840514
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1526672.0000000.078378
Subtotal7.633330100.00000003.918892
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped10.09400098.0000005.182181
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2060002.0000000.105759
Subtotal10.300000100.00000005.287939
Total194.782873100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC9S08RX32AFE
Product content declaration of MC9S08RX32AFE
上次修订 Last Revision (GMT):
Thursday, 12 May 2022, 02:05:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC9S08RX32AFELast Revision (GMT):
Thursday, 12 May 2022, 02:05:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
16 Sep 2021
Test Report
16 Sep 2021
Test Report
16 Sep 2021
Test Report
16 Sep 2021
CDA 194Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
NI PLATINGTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
PD PLATINGTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Die EncapsulantTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Not Available
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Semiconductor Die 1Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 2Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.