MCF5272CVM66J

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of MCF5272CVM66JLast Revision (GMT):
Tuesday, 05 March 2024, 06:44:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCF5272CVM66JSOT879-2LBGA196557.854616 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 101 835572024-03-0463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-52.62535399.9900000.470616
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002630.0100000.000047
Subtotal2.625616100.00000000.470663
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins17.2032006.0000003.083814
Inorganic Silicon compoundsSilica, vitreous60676-86-0212.17280074.00000038.033709
Inorganic Silicon compoundsSilicon dioxide7631-86-943.00800015.0000007.709536
Inorganic compoundsCarbon Black1333-86-41.4336000.5000000.256985
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-45.7344002.0000001.027938
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins7.1680002.5000001.284923
Subtotal286.720000100.000000051.396904
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.82800045.0000000.148426
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001840.0100000.000033
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0920005.0000000.016492
PolymersPlastic: EP - Epoxide, Epoxy0.91981649.9900000.164884
Subtotal1.840000100.00000000.329835
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped8.52600098.0000001.528355
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1740002.0000000.031191
Subtotal8.700000100.00000001.559546
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0010010.0010000.000179
Arsenic and its compoundsArsenic, metal7440-38-20.0010010.0010000.000179
Bismuth and its compoundsBismuth, metal7440-69-90.0010010.0010000.000179
Copper and its compoundsCopper, metal7440-50-80.7008330.7000000.125630
Iron and its compoundsIron, metal7439-89-60.0018020.0018000.000323
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0056070.0056000.001005
Silver and its compoundsSilver, metal7440-22-43.7644743.7600000.674813
Tin and its compoundsTin, metal7440-31-595.64328095.52960017.144840
Subtotal100.119000100.000000017.947149
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAromatic hydrocarbon compoundsOther Aromatic carbonyl compounds1.2133930.7687000.217511
Barium and its compoundsBarium sulfate7727-43-78.7682525.5548001.571781
Copper and its compoundsCopper, metal7440-50-855.57424935.2070009.962139
Epoxy ResinsEpikote 86228064-14-411.8627437.5152002.126494
Gold and its compoundsGold, metal7440-57-52.2383131.4180000.401236
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3131740.1984000.056139
Nickel and its compoundsNickel, metal7440-02-016.97976710.7569003.043762
Phosphorus compoundsDiphenyl cresyl phosphate26444-49-519.83558912.5661003.555691
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-341.06452026.0149007.361151
Subtotal157.850000100.000000028.295903
Total557.854616100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCF5272CVM66J
Product content declaration of MCF5272CVM66J
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 06:44:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCF5272CVM66JLast Revision (GMT):
Tuesday, 05 March 2024, 06:44:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - SAC, Lead FreeTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Substrate, Pre-plated NiAuAUS308Not AvailableTest Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.