MCIMX233DJM4C

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX233DJM4CLast Revision (GMT):
Monday, 04 March 2024, 07:39:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX233DJM4CSOT1542-1LFBGA169280.630739 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 172 785572023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.20342498.0994000.428828
Gold and its compoundsGold, metal7440-57-50.0012270.1000000.000437
Palladium and its compoundsPalladium, metal7440-05-30.0220891.8006000.007871
Subtotal1.226739100.00000000.437136
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins8.1120006.0000002.890631
Inorganic Silicon compoundsSilica, vitreous60676-86-0100.04800074.00000035.651120
Inorganic Silicon compoundsSilicon dioxide7631-86-920.28000015.0000007.226578
Inorganic compoundsCarbon Black1333-86-40.6760000.5000000.240886
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-42.7040002.0000000.963544
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins3.3800002.5000001.204430
Subtotal135.200000100.000000048.177188
Epoxy AdhesiveEpoxy AdhesiveAcrylatesDitrimethylolpropane tetraacrylate94108-97-10.1300005.0000000.046324
Aromatic hydrocarbon compoundsHydroquinone123-31-90.0013000.0500000.000463
Inorganic Silicon compoundsSilicon dioxide7631-86-90.39000015.0000000.138973
Inorganic Silicon compoundsSilylated silica68909-20-61.29870049.9500000.462779
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1300005.0000000.046324
Organic compoundsFatty acids, C18-unsatd., dimers, hydrogenated, polymers with hydrogenated di-Me esters of hydrogenated C18-unsatd. fatty acid dimer177591-08-10.52000020.0000000.185297
Polymers2-Propenoic acid,2-methyl-, 1,1'-(2,2-dimethyl-1,3-propanediyl) ester1985-51-90.1300005.0000000.046324
Subtotal2.600000100.00000000.926484
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-317.54200098.0000006.250919
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3580002.0000000.127570
Subtotal17.900000100.00000006.378489
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0004160.0010000.000148
Antimony and its compoundsAntimony, metal7440-36-00.0208020.0500000.007413
Arsenic and its compoundsArsenic, metal7440-38-20.0124810.0300000.004448
Bismuth and its compoundsBismuth, metal7440-69-90.0124810.0300000.004448
Cadmium and its compoundsCadmium, metal7440-43-90.0008320.0020000.000296
Copper and its compoundsCopper, metal7440-50-80.2080200.5000000.074126
Iron and its compoundsIron, metal7439-89-60.0083210.0200000.002965
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0208020.0500000.007413
Silver and its compoundsSilver, metal7440-22-40.4160401.0000000.148252
Tin and its compoundsTin, metal7440-31-540.90338998.31600014.575520
Zinc and its compoundsZinc, metal7440-66-60.0004160.0010000.000148
Subtotal41.604000100.000000014.825176
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-27.5207719.1605002.679953
Copper and its compoundsCopper, metal7440-50-817.65314221.5020006.290523
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-514.43170217.5782005.142595
Gold and its compoundsGold, metal7440-57-51.2435691.5147000.443134
Inorganic Silicon compoundsFibrous-glass-wool65997-17-318.80188522.9012006.699867
Nickel and its compoundsNickel, metal7440-02-06.7806398.2590002.416214
Organic compoundsOther Bismaleimides7.8341469.5422002.791621
PolymersTriazine25722-66-17.8341469.5422002.791621
Subtotal82.100000100.000000029.255526
Total280.630739100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX233DJM4C
Product content declaration of MCIMX233DJM4C
上次修订 Last Revision (GMT):
Monday, 04 March 2024, 07:39:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX233DJM4CLast Revision (GMT):
Monday, 04 March 2024, 07:39:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
14 Dec 2022
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.