MCIMX253DJM4A

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX253DJM4ALast Revision (GMT):
Wednesday, 06 March 2024, 11:29:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX253DJM4ASOT1512-2LFBGA400833.450319 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 195 925572023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing;Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.16643998.1000000.259936
Gold and its compoundsGold, metal7440-57-50.0022080.1000000.000265
Palladium and its compoundsPalladium, metal7440-05-30.0397511.8000000.004770
Subtotal2.208399100.00000000.264971
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins19.9200005.0000002.390064
Inorganic Silicon compoundsSilica, vitreous60676-86-0266.92800067.00000032.026864
Inorganic Silicon compoundsSilicon dioxide7631-86-999.60000025.00000011.950322
Inorganic compoundsCarbon Black1333-86-41.9920000.5000000.239006
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.9600002.5000001.195032
Subtotal398.400000100.000000047.801290
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.93500045.0000000.232167
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0004300.0100000.000052
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.2150005.0000000.025796
PolymersPlastic: EP - Epoxide, Epoxy2.14957049.9900000.257912
Subtotal4.300000100.00000000.515928
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped30.94146298.0000003.712454
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6314582.0000000.075764
Subtotal31.572920100.00000003.788219
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0010300.0010000.000123
Antimony and its compoundsAntimony, metal7440-36-00.0083410.0081000.001001
Arsenic and its compoundsArsenic, metal7440-38-20.0039130.0038000.000469
Bismuth and its compoundsBismuth, metal7440-69-90.0040160.0039000.000482
Copper and its compoundsCopper, metal7440-50-80.5228770.5078000.062736
Germanium and its compoundsGermanium7440-56-40.0068990.0067000.000828
Iron and its compoundsIron, metal7439-89-60.0035010.0034000.000420
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0230650.0224000.002767
Nickel and its compoundsNickel, metal7440-02-00.0040160.0039000.000482
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0041190.0040000.000494
Silver and its compoundsSilver, metal7440-22-40.9297070.9029000.111549
Tin and its compoundsTin, metal7440-31-5101.45648898.53110012.173070
Zinc and its compoundsZinc, metal7440-66-60.0010300.0010000.000123
Subtotal102.969000100.000000012.354546
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-890.04319599.99000010.803667
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0090050.0100000.001081
Subtotal90.052200100.000000010.804747
Copper PlatingCopper and its compoundsCopper, metal7440-50-873.74984799.9800008.848739
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0147530.0200000.001770
Subtotal73.764600100.00000008.850509
Gold PlatingGold and its compoundsGold, metal7440-57-51.55804499.9900000.186939
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001560.0100000.000019
Subtotal1.558200100.00000000.186958
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0029720.0300000.000357
Nickel and its compoundsNickel, metal7440-02-09.90482899.9700001.188413
Subtotal9.907800100.00000001.188769
Solder MaskBarium and its compoundsBarium sulfate7727-43-715.56227329.1000001.867211
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3208720.6000000.038499
Magnesium and its compoundsTalc14807-96-61.6043583.0000000.192496
Organic compoundsOther organic compounds.1.9252303.6000000.230995
PolymersPlastic: EP - Epoxide, Epoxy10.48180619.6000001.257640
PolymersPlastic: PAK23.58406344.1000002.829690
Subtotal53.478600100.00000006.416531
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-320.87635232.0000002.504811
Inorganic Silicon compoundsSilica, vitreous60676-86-03.9143166.0000000.469652
PolymersPlastic: PI - Polyimide40.44793262.0000004.853071
Subtotal65.238600100.00000007.827533
Total833.450319100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX253DJM4A
Product content declaration of MCIMX253DJM4A
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 11:29:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX253DJM4ALast Revision (GMT):
Wednesday, 06 March 2024, 11:29:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
21 Aug 2021
Test Report
21 Aug 2021
Test Report
21 Aug 2021
Test Report
21 Aug 2021
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
CU PLATINGTest Report
11 Dec 2020
Test Report
11 Dec 2020
Test Report
11 Dec 2020
Test Report
11 Dec 2020
E679FGBTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
25 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.