MCIMX27LMOP4A

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX27LMOP4ALast Revision (GMT):
Tuesday, 25 April 2023, 01:05:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX27LMOP4ASOT1523-1LFBGA473397.390819 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 150 145572020-06-2173 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.09225598.7998000.778139
Palladium and its compoundsPalladium, metal7440-05-30.0375641.2002000.009453
Subtotal3.129819100.00000000.787592
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.71000045.0000000.430307
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0003800.0100000.000096
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1900005.0000000.047812
PolymersPlastic: EP - Epoxide, Epoxy1.89962049.9900000.478023
Subtotal3.800000100.00000000.956237
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.42200098.0000005.893946
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4780002.0000000.120285
Subtotal23.900000100.00000006.014231
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0012180.0010000.000306
Antimony and its compoundsAntimony, metal7440-36-00.0098630.0081000.002482
Arsenic and its compoundsArsenic, metal7440-38-20.0046270.0038000.001164
Bismuth and its compoundsBismuth, metal7440-69-90.0047490.0039000.001195
Copper and its compoundsCopper, metal7440-50-80.6183020.5078000.155590
Germanium and its compoundsGermanium7440-56-40.0081580.0067000.002053
Iron and its compoundsIron, metal7439-89-60.0041400.0034000.001042
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0272750.0224000.006863
Nickel and its compoundsNickel, metal7440-02-00.0047490.0039000.001195
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0048700.0040000.001226
Silver and its compoundsSilver, metal7440-22-41.0993800.9029000.276650
Tin and its compoundsTin, metal7440-31-5119.97245398.53110030.190041
Zinc and its compoundsZinc, metal7440-66-60.0012180.0010000.000306
Subtotal121.761000100.000000030.640114
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-880.87383299.99000020.351208
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0080880.0100000.002035
Subtotal80.881920100.000000020.353243
Copper PlatingCopper and its compoundsCopper, metal7440-50-849.43971099.98000012.441080
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0098900.0200000.002489
Subtotal49.449600100.000000012.443569
Gold PlatingGold and its compoundsGold, metal7440-57-51.17492399.9900000.295659
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001170.0100000.000030
Subtotal1.175040100.00000000.295689
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0019390.0300000.000488
Nickel and its compoundsNickel, metal7440-02-06.46078199.9700001.625800
Subtotal6.462720100.00000001.626288
Solder MaskBarium and its compoundsBarium sulfate7727-43-714.04789729.1000003.535033
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2896470.6000000.072887
Magnesium and its compoundsTalc14807-96-61.4482373.0000000.364436
Organic compoundsOther organic compounds.1.7378843.6000000.437324
PolymersPlastic: EP - Epoxide, Epoxy9.46181419.6000002.380984
PolymersPlastic: PAK21.28908144.1000005.357215
Subtotal48.274560100.000000012.147880
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-327.87273247.6000007.013935
Inorganic Silicon compoundsSilica, vitreous60676-86-02.8106964.8000000.707287
PolymersPlastic: PI - Polyimide27.87273247.6000007.013935
Subtotal58.556160100.000000014.735157
Total397.390819100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX27LMOP4A
Product content declaration of MCIMX27LMOP4A
上次修订 Last Revision (GMT):
Tuesday, 25 April 2023, 01:05:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX27LMOP4ALast Revision (GMT):
Tuesday, 25 April 2023, 01:05:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
29 Sep 2022
Test Report
29 Sep 2022
Test Report
29 Sep 2022
Test Report
29 Sep 2022
Epoxy AdhesiveTest Report
29 Jun 2022
Test Report
29 Jun 2022
Test Report
29 Jun 2022
Test Report
29 Jun 2022
Semiconductor DieTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Solder Ball - SAC, Lead FreeTest Report
18 Oct 2022
Test Report
18 Oct 2022
Test Report
18 Oct 2022
Test Report
18 Oct 2022
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.