MCIMX27LMOP4AR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX27LMOP4AR2Last Revision (GMT):
Monday, 01 April 2024, 07:21:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX27LMOP4AR2SOT1523-1LFBGA473913.690819 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 150 145182023-11-24113 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.09225598.7998000.338436
Palladium and its compoundsPalladium, metal7440-05-30.0375641.2002000.004111
Subtotal3.129819100.00000000.342547
Die EncapsulantDie EncapsulantAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.2581500.0500000.028254
Aluminum and its compoundsProprietary Material-Other aluminum compounds5.1630001.0000000.565071
Epoxy ResinsOther Epoxy resins12.9075002.5000001.412677
Epoxy ResinsProprietary Material-Other Epoxy resins12.9075002.5000001.412677
Inorganic Silicon compoundsSilica, vitreous60676-86-0358.57035069.45000039.244167
Inorganic Silicon compoundsSilicon dioxide7631-86-9103.26000020.00000011.301416
Inorganic compoundsCarbon Black1333-86-42.5815000.5000000.282535
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins20.6520004.0000002.260283
Subtotal516.300000100.000000056.507080
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.71000045.0000000.187153
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0003800.0100000.000042
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1900005.0000000.020795
PolymersPlastic: EP - Epoxide, Epoxy1.89962049.9900000.207906
Subtotal3.800000100.00000000.415896
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.42200098.0000002.563449
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4780002.0000000.052315
Subtotal23.900000100.00000002.615765
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0012180.0010000.000133
Antimony and its compoundsAntimony, metal7440-36-00.0098630.0081000.001079
Arsenic and its compoundsArsenic, metal7440-38-20.0046270.0038000.000506
Bismuth and its compoundsBismuth, metal7440-69-90.0047490.0039000.000520
Copper and its compoundsCopper, metal7440-50-80.6183020.5078000.067671
Germanium and its compoundsGermanium7440-56-40.0081580.0067000.000893
Iron and its compoundsIron, metal7439-89-60.0041400.0034000.000453
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0272750.0224000.002985
Nickel and its compoundsNickel, metal7440-02-00.0047490.0039000.000520
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0048700.0040000.000533
Silver and its compoundsSilver, metal7440-22-41.0993800.9029000.120323
Tin and its compoundsTin, metal7440-31-5119.97245398.53110013.130531
Zinc and its compoundsZinc, metal7440-66-60.0012180.0010000.000133
Subtotal121.761000100.000000013.326280
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-880.87383299.9900008.851335
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0080880.0100000.000885
Subtotal80.881920100.00000008.852220
Copper PlatingCopper and its compoundsCopper, metal7440-50-849.43971099.9800005.410989
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0098900.0200000.001082
Subtotal49.449600100.00000005.412071
Gold PlatingGold and its compoundsGold, metal7440-57-51.17492399.9900000.128591
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001170.0100000.000013
Subtotal1.175040100.00000000.128604
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0019390.0300000.000212
Nickel and its compoundsNickel, metal7440-02-06.46078199.9700000.707108
Subtotal6.462720100.00000000.707320
Solder MaskBarium and its compoundsBarium sulfate7727-43-714.04789729.1000001.537489
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2896470.6000000.031701
Magnesium and its compoundsTalc14807-96-61.4482373.0000000.158504
Organic compoundsOther organic compounds.1.7378843.6000000.190205
PolymersPlastic: EP - Epoxide, Epoxy9.46181419.6000001.035560
PolymersPlastic: PAK21.28908144.1000002.330009
Subtotal48.274560100.00000005.283468
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-327.87273247.6000003.050565
Inorganic Silicon compoundsSilica, vitreous60676-86-02.8106964.8000000.307620
PolymersPlastic: PI - Polyimide27.87273247.6000003.050565
Subtotal58.556160100.00000006.408750
Total913.690819100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX27LMOP4AR2
Product content declaration of MCIMX27LMOP4AR2
上次修订 Last Revision (GMT):
Monday, 01 April 2024, 07:21:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX27LMOP4AR2Last Revision (GMT):
Monday, 01 April 2024, 07:21:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
SubstrateAU PLATINGTest Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
CORETest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
NI PLATINGTest Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
SOLDER MASKTest Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.