MCIMX31LCVKN5D

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX31LCVKN5DLast Revision (GMT):
Wednesday, 21 December 2022, 09:50:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX31LCVKN5DSOT1539-1LFBGA457417.132303 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 228 845572023-11-2453 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing;Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.54169497.0000000.609326
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0786093.0000000.018845
Subtotal2.620303100.00000000.628171
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins11.0809045.7683002.656448
Inorganic Silicon compoundsSilica, vitreous60676-86-0171.34878289.19770041.077802
Inorganic compoundsCarbon Black1333-86-40.6043470.3146000.144881
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.0659674.7194002.173403
Subtotal192.100000100.000000046.052535
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsOther Non-halogenated Epoxy resins0.2250005.0000000.053940
Organic compoundsProprietary Material-Functionalized Ester0.45000010.0000000.107879
PolymersProprietary Material-Di-ester resin0.45000010.0000000.107879
RosinsPolymerized rosin65997-05-90.2250005.0000000.053940
Silver and its compoundsSilver, metal7440-22-43.15000070.0000000.755156
Subtotal4.500000100.00000001.078794
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-314.94500098.0000003.582796
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3050002.0000000.073118
Subtotal15.250000100.00000003.655914
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.2373100.5000000.056891
Silver and its compoundsSilver, metal7440-22-40.4746201.0000000.113782
Tin and its compoundsTin, metal7440-31-546.75007098.50000011.207492
Subtotal47.462000100.000000011.378165
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-29.1673545.9068002.197709
Aromatic amines and their saltsProprietary Material-Other aromatic amines0.0993280.0640000.023812
Aromatic hydrocarbon compoundsProprietary Material-Other Aromatic carbonyl compounds0.6208000.4000000.148826
Azo compoundsProprietary Material-Other azo dyes0.0496640.0320000.011906
Barium and its compoundsBarium sulfate7727-43-71.6140801.0400000.386947
Copper and its compoundsCopper, metal7440-50-869.84000045.00000016.742889
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-513.2720838.5516003.181744
Epoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins12.0595067.7703002.891050
Glycidyl ethersProprietary Material-Other Ethylene Glycol Monomethyl or Monoethyl Ethers or their Acetates3.5261442.2720000.845330
Gold and its compoundsGold, metal7440-57-51.5520001.0000000.372064
Inorganic Silicon compoundsFibrous-glass-wool65997-17-35.3362423.4383001.279268
Inorganic Silicon compoundsOther silica compounds4.7925763.0880001.148934
Inorganic compoundsOther inorganic compounds8.7568505.6423002.099298
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.9932800.6400000.238121
Nickel and its compoundsNickel, metal7440-02-04.6560003.0000001.116193
Organic compoundsDipropylene glycol monomethyl ether34590-94-82.2597121.4560000.541725
Organic compoundsOther Bismaleimides5.8836323.7910001.410495
Organic compoundsProprietary Material-Other organic compounds.0.3228160.2080000.077389
PolymersProprietary Material-Other acrylic resins7.2509444.6720001.738284
PolymersTriazine25722-66-13.1469902.0277000.754435
Subtotal155.200000100.000000037.206421
Total417.132303100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX31LCVKN5D
Product content declaration of MCIMX31LCVKN5D
上次修订 Last Revision (GMT):
Wednesday, 21 December 2022, 09:50:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX31LCVKN5DLast Revision (GMT):
Wednesday, 21 December 2022, 09:50:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
20 Oct 2023
Test Report
20 Oct 2023
Test Report
20 Oct 2023
Test Report
20 Oct 2023
Die EncapsulantTest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - SAC, Lead FreeTest Report
24 Jul 2023
Test Report
24 Jul 2023
Test Report
24 Jul 2023
Test Report
24 Jul 2023
Substrate, Pre-plated NiAuAUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
HL832Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.