MCIMX353CJQ5C

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX353CJQ5CLast Revision (GMT):
Tuesday, 31 October 2023, 01:56:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX353CJQ5CSOT1512-2LFBGA400835.377399 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 254 875572023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing;Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.16643998.1000000.259337
Gold and its compoundsGold, metal7440-57-50.0022080.1000000.000264
Palladium and its compoundsPalladium, metal7440-05-30.0397511.8000000.004758
Subtotal2.208399100.00000000.264360
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins19.9200005.0000002.384551
Inorganic Silicon compoundsSilica, vitreous60676-86-0266.92800067.00000031.952983
Inorganic Silicon compoundsSilicon dioxide7631-86-999.60000025.00000011.922755
Inorganic compoundsCarbon Black1333-86-41.9920000.5000000.238455
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.9600002.5000001.192276
Subtotal398.400000100.000000047.691020
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.93500045.0000000.231632
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0004300.0100000.000051
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.2150005.0000000.025737
PolymersPlastic: EP - Epoxide, Epoxy2.14957049.9900000.257317
Subtotal4.300000100.00000000.514737
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-332.83000098.0000003.929960
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6700002.0000000.080203
Subtotal33.500000100.00000004.010164
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0010300.0010000.000123
Antimony and its compoundsAntimony, metal7440-36-00.0083410.0081000.000998
Arsenic and its compoundsArsenic, metal7440-38-20.0039130.0038000.000468
Bismuth and its compoundsBismuth, metal7440-69-90.0040160.0039000.000481
Copper and its compoundsCopper, metal7440-50-80.5228770.5078000.062592
Germanium and its compoundsGermanium7440-56-40.0068990.0067000.000826
Iron and its compoundsIron, metal7439-89-60.0035010.0034000.000419
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0230650.0224000.002761
Nickel and its compoundsNickel, metal7440-02-00.0040160.0039000.000481
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0041190.0040000.000493
Silver and its compoundsSilver, metal7440-22-40.9297070.9029000.111292
Tin and its compoundsTin, metal7440-31-5101.45648898.53110012.144988
Zinc and its compoundsZinc, metal7440-66-60.0010300.0010000.000123
Subtotal102.969000100.000000012.326046
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-893.45325499.99000011.186950
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0093460.0100000.001119
Subtotal93.462600100.000000011.188069
Copper PlatingCopper and its compoundsCopper, metal7440-50-857.52429399.9800006.886025
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0115070.0200000.001378
Subtotal57.535800100.00000006.887402
Gold PlatingGold and its compoundsGold, metal7440-57-51.58744199.9900000.190027
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001590.0100000.000019
Subtotal1.587600100.00000000.190046
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0030160.0300000.000361
Nickel and its compoundsNickel, metal7440-02-010.05178499.9700001.203263
Subtotal10.054800100.00000001.203624
Solder MaskBarium and its compoundsBarium sulfate7727-43-718.52244129.1000002.217254
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3819060.6000000.045717
Magnesium and its compoundsTalc14807-96-61.9095303.0000000.228583
Organic compoundsOther organic compounds.2.2914363.6000000.274299
PolymersPlastic: EP - Epoxide, Epoxy12.47559619.6000001.493408
PolymersPlastic: PAK28.07009144.1000003.360169
Subtotal63.651000100.00000007.619430
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-332.22910347.6000003.858029
Inorganic Silicon compoundsSilica, vitreous60676-86-03.2499944.8000000.389045
PolymersPlastic: PI - Polyimide32.22910347.6000003.858029
Subtotal67.708200100.00000008.105103
Total835.377399100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX353CJQ5C
Product content declaration of MCIMX353CJQ5C
上次修订 Last Revision (GMT):
Tuesday, 31 October 2023, 01:56:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX353CJQ5CLast Revision (GMT):
Tuesday, 31 October 2023, 01:56:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
AUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
CU PLATINGTest Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
2 Jul 2021
E679FGBTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
25 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.