MCIMX508CVK8B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX508CVK8BLast Revision (GMT):
Wednesday, 29 June 2022, 06:02:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX508CVK8BSOT1548-1LFBGA416417.919565 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 173 675572020-06-2163 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing;Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.34828597.0000000.322618
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0417003.0000000.009978
Subtotal1.389985100.00000000.332596
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins13.6247255.7683003.260131
Inorganic Silicon compoundsSilica, vitreous60676-86-0210.68496789.19770050.412803
Inorganic compoundsCarbon Black1333-86-40.7430850.3146000.177806
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins11.1472234.7194002.667313
Subtotal236.200000100.000000056.518053
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsOther Non-halogenated Epoxy resins0.0750005.0000000.017946
Organic compoundsProprietary Material-Functionalized Ester0.15000010.0000000.035892
PolymersProprietary Material-Di-ester resin0.15000010.0000000.035892
RosinsPolymerized rosin65997-05-90.0750005.0000000.017946
Silver and its compoundsSilver, metal7440-22-41.05000070.0000000.251244
Subtotal1.500000100.00000000.358921
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.15306898.0000005.540078
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4725122.0000000.113063
Subtotal23.625580100.00000005.653140
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.2160200.5000000.051689
Silver and its compoundsSilver, metal7440-22-40.4320401.0000000.103379
Tin and its compoundsTin, metal7440-31-542.55594098.50000010.182806
Subtotal43.204000100.000000010.337874
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAliphatic AminesProprietary Material-Other aliphatic amine compounds0.0806400.0720000.019296
Aromatic hydrocarbon compoundsProprietary Material-Other Aromatic carbonyl compounds0.5040000.4500000.120597
Azo compoundsProprietary Material-Other azo dyes0.0403200.0360000.009648
Barium and its compoundsBarium sulfate7727-43-75.2012804.6440001.244565
Copper and its compoundsCopper, metal7440-50-870.51083262.95610016.871867
Epoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins17.61816015.7305004.215682
Gold and its compoundsGold, metal7440-57-51.1200001.0000000.267994
Inorganic Silicon compoundsProprietary Material-Other glass compounds (without lead, chromium, cadmium or mercury)9.2527688.2614002.214007
Inorganic compoundsOther inorganic compounds0.2620800.2340000.062711
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8064000.7200000.192956
Nickel and its compoundsNickel, metal7440-02-01.1200001.0000000.267994
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-92.8627202.5560000.684993
Organic compoundsDipropylene glycol monomethyl ether34590-94-81.8345601.6380000.438974
PolymersOther acrylic resins0.7862400.7020000.188132
Subtotal112.000000100.000000026.799415
Total417.919565100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX508CVK8B
Product content declaration of MCIMX508CVK8B
上次修订 Last Revision (GMT):
Wednesday, 29 June 2022, 06:02:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX508CVK8BLast Revision (GMT):
Wednesday, 29 June 2022, 06:02:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Die EncapsulantTest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.