MCIMX513DJM8C

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MCIMX513DJM8CLast Revision (GMT):
Tuesday, 28 June 2022, 08:04:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX513DJM8CSOT1526-2LFBGA5291004.458674 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 243 335572020-06-2263 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.35775497.0000000.234729
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0729203.0000000.007260
Subtotal2.430674100.00000000.241988
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-59.7188572.0010000.967572
Inorganic Silicon compoundsSilica, vitreous60676-86-0339.91714569.98500033.840829
Inorganic Silicon compoundsSilicon dioxide7631-86-987.46971318.0090008.708144
Magnesium and its compoundsMagnesium, metal7439-95-44.8594281.0005000.483786
Phenols and Phenolic ResinsOther phenolic resins14.5782853.0015001.451357
PolymersOther acrylic/epoxy resin mixture29.1565716.0030002.902715
Subtotal485.700000100.000000048.354403
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.27000045.0000000.026880
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0000600.0100000.000006
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0300005.0000000.002987
PolymersPlastic: EP - Epoxide, Epoxy0.29994049.9900000.029861
Subtotal0.600000100.00000000.059734
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-324.50000098.0000002.439125
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5000002.0000000.049778
Subtotal25.000000100.00000002.488903
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0013020.0010000.000130
Antimony and its compoundsAntimony, metal7440-36-00.0651140.0500000.006483
Arsenic and its compoundsArsenic, metal7440-38-20.0390680.0300000.003890
Bismuth and its compoundsBismuth, metal7440-69-90.0390680.0300000.003890
Cadmium and its compoundsCadmium, metal7440-43-90.0026050.0020000.000259
Copper and its compoundsCopper, metal7440-50-80.6511400.5000000.064825
Iron and its compoundsIron, metal7439-89-60.0260460.0200000.002593
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0651140.0500000.006483
Silver and its compoundsSilver, metal7440-22-41.3022801.0000000.129650
Tin and its compoundsTin, metal7440-31-5128.03496098.31600012.746663
Zinc and its compoundsZinc, metal7440-66-60.0013020.0010000.000130
Subtotal130.228000100.000000012.964993
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuBarium and its compoundsBarium sulfate7727-43-721.6300006.0000002.153399
Copper and its compoundsCopper, metal7440-50-8100.94000028.00000010.049194
Epoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins10.8150003.0000001.076699
Gold and its compoundsGold, metal7440-57-52.8840000.8000000.287120
Inorganic Silicon compoundsFibrous-glass-wool65997-17-379.31000022.0000007.895795
Inorganic compoundsOther inorganic compounds30.6425008.5000003.050648
Magnesium and its compoundsTalc14807-96-62.8840000.8000000.287120
Nickel and its compoundsNickel, metal7440-02-015.1410004.2000001.507379
Organic compoundsDipropylene glycol monomethyl ether34590-94-812.9780003.6000001.292039
Organic compoundsOther morpholine compounds0.3605000.1000000.035890
PolymersProprietary Material-Other acrylic/epoxy resin mixture82.91500023.0000008.254695
Subtotal360.500000100.000000035.889978
Total1004.458674100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX513DJM8C
Product content declaration of MCIMX513DJM8C
上次修订 Last Revision (GMT):
Tuesday, 28 June 2022, 08:04:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX513DJM8CLast Revision (GMT):
Tuesday, 28 June 2022, 08:04:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Die EncapsulantTest Report
26 Mar 2021
Test Report
26 Mar 2021
Test Report
26 Mar 2021
Test Report
26 Mar 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
9 Nov 2021
Test Report
9 Nov 2021
Test Report
9 Nov 2021
Test Report
9 Nov 2021
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.