MCIMX6Q5EYM12AC

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MCIMX6Q5EYM12ACLast Revision (GMT):
Tuesday, 04 October 2022, 12:16:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6Q5EYM12ACSOT1642-1LFBGA6241272.525000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 199 085572020-10-15103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped36.73600089.6000002.886859
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3690000.9000000.028997
Nickel and its compoundsNickel, metal7440-02-00.2050000.5000000.016110
Silver and its compoundsSilver, metal7440-22-40.1291500.3150000.010149
Tin and its compoundsTin, metal7440-31-53.5608508.6850000.279826
Subtotal41.000000100.00000003.221941
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.8157500.6000000.142689
Silver and its compoundsSilver, metal7440-22-49.0787503.0000000.713444
Tin and its compoundsTin, metal7440-31-5291.73050096.40000022.925326
Subtotal302.625000100.000000023.781458
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-898.11811599.8700007.710506
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1277200.1300000.010037
Subtotal98.245835100.00000007.720543
Copper PlatingCopper and its compoundsCopper, metal7440-50-8376.70864099.75000029.603241
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9441320.2500000.074194
Subtotal377.652772100.000000029.677434
DielectricEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-58.34589210.4600000.655853
Inorganic Silicon compoundsSilicon dioxide7631-86-933.39154541.8500002.624038
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-68.34589210.4600000.655853
PolymersPlastic: EP - Epoxide, Epoxy29.70531037.2300002.334360
Subtotal79.788638100.00000006.270104
Solder 1Copper and its compoundsCopper, metal7440-50-80.0741310.5000000.005825
Silver and its compoundsSilver, metal7440-22-40.4447883.0000000.034953
Tin and its compoundsTin, metal7440-31-514.30735396.5000001.124328
Subtotal14.826273100.00000001.165107
Solder 2Copper and its compoundsCopper, metal7440-50-80.0093070.5000000.000731
Silver and its compoundsSilver, metal7440-22-40.0558393.0000000.004388
Tin and its compoundsTin, metal7440-31-51.79616196.5000000.141149
Subtotal1.861307100.00000000.146269
Solder MaskBarium and its compoundsBarium sulfate7727-43-78.91790729.5000000.700804
Inorganic compoundsProprietary Material - Other inorganic compounds0.1813810.6000000.014254
Magnesium and its compoundsTalc14807-96-60.9673663.2000000.076019
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6952942.3000000.054639
PolymersPlastic: EP - Epoxide, Epoxy5.98557819.8000000.470370
PolymersPlastic: PAK13.48266644.6000001.059521
Subtotal30.230193100.00000002.375607
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3155.55208550.00000012.223892
Inorganic Silicon compoundsSilica, vitreous60676-86-015.5552095.0000001.222389
PolymersPlastic: EP - Epoxide, Epoxy139.99687745.00000011.001503
Subtotal311.104170100.000000024.447785
Via PluggingCalcium and its compoundsCalcium-carbonate471-34-11.67070952.3600000.131291
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.2364397.4100000.018580
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0165920.5200000.001304
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.71346622.3600000.056067
PolymersPlastic: EP - Epoxide, Epoxy0.55360617.3500000.043505
Subtotal3.190812100.00000000.250746
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-31.32000011.0000000.103731
Bismuth and its compoundsBismuth nitrate10361-44-10.0120000.1000000.000943
Bismuth and its compoundsBismuth trioxide1304-76-30.0960000.8000000.007544
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.68000014.0000000.132021
Epoxy ResinsOther Epoxy resins0.4800004.0000000.037720
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000010.0000000.094301
Inorganic Silicon compoundsSilica, vitreous60676-86-07.20000060.0000000.565804
Inorganic compoundsCarbon Black1333-86-40.0120000.1000000.000943
Subtotal12.000000100.00000000.943007
Total1272.525000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6Q5EYM12AC
Product content declaration of MCIMX6Q5EYM12AC
上次修订 Last Revision (GMT):
Tuesday, 04 October 2022, 12:16:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

电介质
Dielectric
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6Q5EYM12ACLast Revision (GMT):
Tuesday, 04 October 2022, 12:16:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
SubstrateAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
CU FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
CU PLATINGTest Report
29 Nov 2021
Test Report
29 Nov 2021
Test Report
29 Nov 2021
Test Report
29 Nov 2021
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
PHP-900 IR-6Test Report
18 Jun 2021
Not AvailableTest Report
18 Jun 2021
Test Report
16 Jul 2020
SOLDER 1Test Report
14 Oct 2021
Test Report
14 Oct 2021
Not AvailableTest Report
14 Oct 2021
SOLDER 2Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.