MCIMX6Q7CZK08AE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX6Q7CZK08AELast Revision (GMT):
Thursday, 14 April 2022, 01:38:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6Q7CZK08AESOT1644-1LFBGA569S224.751000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 543 295572020-10-1583 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-18.30000020.0000003.692976
Epoxy ResinsOther Epoxy resins2.4900006.0000001.107893
Inorganic Silicon compoundsSilica, vitreous60676-86-018.67500045.0000008.309195
Inorganic Silicon compoundsSilicon dioxide7631-86-910.37500025.0000004.616220
Inorganic compoundsCarbon Black1333-86-40.2075000.5000000.092324
Phenols and Phenolic ResinsOther phenolic resins1.4525003.5000000.646271
Subtotal41.500000100.000000018.464879
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped11.91680089.6000005.302223
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1197000.9000000.053259
Nickel and its compoundsNickel, metal7440-02-00.0665000.5000000.029588
Silver and its compoundsSilver, metal7440-22-40.0418950.3150000.018641
Tin and its compoundsTin, metal7440-31-51.1551058.6850000.513949
Subtotal13.300000100.00000005.917660
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.1942050.5000000.086409
Silver and its compoundsSilver, metal7440-22-40.3884101.0000000.172818
Tin and its compoundsTin, metal7440-31-538.25838598.50000017.022565
Subtotal38.841000100.000000017.281792
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-836.99155199.90000016.458904
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0370290.1000000.016475
Subtotal37.028580100.000000016.475379
SolderCopper and its compoundsCopper, metal7440-50-80.0036520.5000000.001625
Silver and its compoundsSilver, metal7440-22-40.0219133.0000000.009750
Tin and its compoundsTin, metal7440-31-50.70485596.5000000.313616
Subtotal0.730420100.00000000.324991
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.74308531.1000000.330626
Copper and its compoundsCopper phthalocyanine147-14-80.0047790.2000000.002126
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0119470.5000000.005315
Magnesium and its compoundsTalc14807-96-60.0860163.6000000.038272
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0262831.1000000.011694
Organic compoundsOther organic compounds.0.0023890.1000000.001063
PolymersPlastic: EP - Epoxide, Epoxy1.51484263.4000000.674009
Subtotal2.389340100.00000001.063105
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-30.86678610.4500000.385665
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.86678610.4500000.385665
Inorganic Silicon compoundsSilicon dioxide7631-86-93.47129041.8500001.544505
PolymersPlastic: EP - Epoxide, Epoxy3.08973937.2500001.374739
Subtotal8.294600100.00000003.690573
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-337.67853050.00000016.764566
Inorganic Silicon compoundsSilica, vitreous60676-86-03.7678535.0000001.676457
PolymersPlastic: EP - Epoxide, Epoxy33.91067745.00000015.088109
Subtotal75.357060100.000000033.529132
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amine compounds0.5117007.0000000.227674
Aniline and its saltsp-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline5026-74-40.73100010.0000000.325249
Bismuth and its compoundsBismuth nitrate10361-44-10.0292400.4000000.013010
Bismuth and its compoundsBismuth trioxide1304-76-30.0292400.4000000.013010
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.73100010.0000000.325249
Inorganic Silicon compoundsSilica, vitreous60676-86-04.75150065.0000002.114117
Inorganic compoundsCarbon Black1333-86-40.0731001.0000000.032525
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1608202.2000000.071555
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.2924004.0000000.130100
Subtotal7.310000100.00000003.252488
Total224.751000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6Q7CZK08AE
Product content declaration of MCIMX6Q7CZK08AE
上次修订 Last Revision (GMT):
Thursday, 14 April 2022, 01:38:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6Q7CZK08AELast Revision (GMT):
Thursday, 14 April 2022, 01:38:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
3 Dec 2019
Test Report
3 Dec 2019
Test Report
3 Dec 2019
Test Report
3 Dec 2019
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - SAC, Lead FreeTest Report
23 Jul 2018
Test Report
23 Jul 2018
Test Report
23 Jul 2018
Test Report
23 Jul 2018
SubstrateCU FOILTest Report
21 Dec 2021
Test Report
7 Jan 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.