MCIMX6QP5EYM1AB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX6QP5EYM1ABLast Revision (GMT):
Thursday, 05 October 2023, 05:34:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6QP5EYM1ABSOT1642LFBGA6241276.775700 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 578 365572023-11-2493 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-333.95840089.6000002.659700
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3411000.9000000.026716
Nickel and its compoundsNickel, metal7440-02-00.1895000.5000000.014842
Silver and its compoundsSilver, metal7440-22-40.1193850.3150000.009350
Tin and its compoundsTin, metal7440-31-53.2916158.6850000.257807
Subtotal37.900000100.00000002.968415
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.8157500.6000000.142214
Silver and its compoundsSilver, metal7440-22-49.0787503.0000000.711068
Tin and its compoundsTin, metal7440-31-5291.73050096.40000022.849002
Subtotal302.625000100.000000023.702284
SubstrateCopper FoilArsenic and its compoundsArsenic, metal7440-38-20.0003890.0010000.000030
Cobalt and its compoundsCobalt, metal7440-48-40.0155500.0400000.001218
Copper and its compoundsCopper, metal7440-50-838.84024099.9090003.042057
Nickel and its compoundsNickel, metal7440-02-00.0194380.0500000.001522
Subtotal38.875616100.00000003.044827
Copper PlatingCopper and its compoundsCopper, metal7440-50-8364.99525899.99000028.587265
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0365030.0100000.002859
Subtotal365.031762100.000000028.590124
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-38.65216110.4500000.677657
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-58.65216110.4500000.677657
Inorganic Silicon compoundsSilicon dioxide7631-86-934.65004341.8500002.713871
PolymersPlastic: EP - Epoxide, Epoxy30.84143637.2500002.415572
Subtotal82.795801100.00000006.484757
Solder BallCopper and its compoundsCopper, metal7440-50-80.0979610.5000000.007672
Silver and its compoundsSilver, metal7440-22-40.5877653.0000000.046035
Tin and its compoundsTin, metal7440-31-518.90644296.5000001.480796
Subtotal19.592168100.00000001.534504
Solder MaskBarium and its compoundsBarium sulfate7727-43-79.69546831.1000000.759371
Copper and its compoundsCopper phthalocyanine147-14-80.0623500.2000000.004883
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1558760.5000000.012209
Magnesium and its compoundsTalc14807-96-61.1223053.6000000.087901
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3429271.1000000.026859
Organic compoundsOther organic compounds.0.0311750.1000000.002442
PolymersPlastic: EP - Epoxide, Epoxy19.76503863.4000001.548043
Subtotal31.175139100.00000002.441708
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3191.06787150.00000014.964874
Inorganic Silicon compoundsSilica, vitreous60676-86-019.1067875.0000001.496487
PolymersPlastic: EP - Epoxide, Epoxy171.96108445.00000013.468386
Subtotal382.135742100.000000029.929748
Via PluggingInorganic Silicon compoundsSilicon dioxide7631-86-90.85556844.0000000.067010
Phenols and Phenolic Resins2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane115254-47-21.08890456.0000000.085286
Subtotal1.944472100.00000000.152296
UnderfillUnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-31.61700011.0000000.126647
Bismuth and its compoundsBismuth nitrate10361-44-10.0147000.1000000.001151
Bismuth and its compoundsBismuth trioxide1304-76-30.1176000.8000000.009211
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-62.05800014.0000000.161187
Epoxy ResinsOther Epoxy resins0.5880004.0000000.046053
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.47000010.0000000.115134
Inorganic Silicon compoundsSilica, vitreous60676-86-08.82000060.0000000.690803
Inorganic compoundsCarbon Black1333-86-40.0147000.1000000.001151
Subtotal14.700000100.00000001.151338
Total1276.775700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6QP5EYM1AB
Product content declaration of MCIMX6QP5EYM1AB
上次修订 Last Revision (GMT):
Thursday, 05 October 2023, 05:34:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6QP5EYM1ABLast Revision (GMT):
Thursday, 05 October 2023, 05:34:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - SAC, Lead FreeTest Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
SubstrateABF-GX13Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
AUS703Test Report
10 Nov 2022
Test Report
10 Nov 2022
Test Report
10 Nov 2022
Test Report
10 Nov 2022
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
9 Dec 2021
Test Report
9 Dec 2021
Test Report
9 Dec 2021
Test Report
9 Dec 2021
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
PHP-900 IR-6Test Report
20 Apr 2023
Test Report
18 Jun 2023
Test Report
20 Apr 2023
Test Report
17 Feb 2022
SAC305Test Report
8 Nov 2021
Test Report
8 Nov 2021
Test Report
8 Nov 2021
Test Report
8 Nov 2021
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.