MCIMX6S4AVM08ABR

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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX6S4AVM08ABRLast Revision (GMT):
Wednesday, 27 December 2023, 08:57:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX6S4AVM08ABRSOT1529-1LFBGA6241246.524951 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 233 225182023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing;Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-88.14220298.0994000.653192
Gold and its compoundsGold, metal7440-57-50.0083000.1000000.000666
Palladium and its compoundsPalladium, metal7440-05-30.1494491.8006000.011989
Subtotal8.299951100.00000000.665847
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-514.0250092.0010001.125129
Inorganic Silicon compoundsSilica, vitreous60676-86-0490.52486569.98500039.351388
Inorganic Silicon compoundsSilicon dioxide7631-86-9126.22508118.00900010.126158
Magnesium and its compoundsMagnesium, metal7439-95-47.0125051.0005000.562564
Phenols and Phenolic ResinsOther phenolic resins21.0375133.0015001.687693
PolymersOther acrylic/epoxy resin mixture42.0750276.0030003.375386
Subtotal700.900000100.000000056.228317
Epoxy AdhesiveEpoxy AdhesiveAcrylatesDitrimethylolpropane tetraacrylate94108-97-10.0750005.0000000.006017
Aromatic hydrocarbon compoundsHydroquinone123-31-90.0007500.0500000.000060
Inorganic Silicon compoundsSilicon dioxide7631-86-90.22500015.0000000.018050
Inorganic Silicon compoundsSilylated silica68909-20-60.74925049.9500000.060107
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0750005.0000000.006017
Organic compoundsFatty acids, C18-unsatd., dimers, hydrogenated, polymers with hydrogenated di-Me esters of hydrogenated C18-unsatd. fatty acid dimer177591-08-10.30000020.0000000.024067
Polymers2-Propenoic acid,2-methyl-, 1,1'-(2,2-dimethyl-1,3-propanediyl) ester1985-51-90.0750005.0000000.006017
Subtotal1.500000100.00000000.120334
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-318.03200098.0000001.446582
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3680002.0000000.029522
Subtotal18.400000100.00000001.476104
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.5158490.5009000.121606
Silver and its compoundsSilver, metal7440-22-49.0950923.0054000.729636
Tin and its compoundsTin, metal7440-31-5292.01406096.49370023.426251
Subtotal302.625000100.000000024.277493
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0024550.0050000.000197
Copper and its compoundsCopper, metal7440-50-849.06247399.9250003.935940
Nickel and its compoundsNickel, metal7440-02-00.0245500.0500000.001969
Zinc and its compoundsZinc, metal7440-66-60.0098200.0200000.000788
Subtotal49.099298100.00000003.938894
Copper PlatingCopper and its compoundsCopper, metal7440-50-825.36578699.9900002.034920
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0025370.0100000.000204
Subtotal25.368323100.00000002.035124
Gold PlatingGold and its compoundsGold, metal7440-57-55.31849699.9900000.426666
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005320.0100000.000043
Subtotal5.319028100.00000000.426708
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0040920.0100000.000328
Nickel and its compoundsNickel, metal7440-02-040.91256899.9900003.282130
Subtotal40.916659100.00000003.282458
Solder MaskBarium and its compoundsBarium sulfate7727-43-711.90376329.1000000.954956
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2454380.6000000.019690
Magnesium and its compoundsTalc14807-96-61.2271923.0000000.098449
Organic compoundsOther organic compounds.1.4726303.6000000.118139
PolymersPlastic: EP - Epoxide, Epoxy8.01765519.6000000.643200
PolymersPlastic: PAK18.03972444.1000001.447201
Subtotal40.906402100.00000003.281635
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-611.59548321.8000000.930225
Inorganic Silicon compoundsFibrous-glass-wool65997-17-323.82925044.8000001.911655
Inorganic Silicon compoundsSilicon dioxide7631-86-90.6382841.2000000.051205
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.4041796.4000000.273093
Phenols - SpecificBisphenol A80-05-70.5319031.0000000.042671
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)7.65940214.4000000.614460
PolymersPlastic: EP - Epoxide, Epoxy5.53179010.4000000.443777
Subtotal53.190290100.00000004.267086
Total1246.524951100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX6S4AVM08ABR
Product content declaration of MCIMX6S4AVM08ABR
上次修订 Last Revision (GMT):
Wednesday, 27 December 2023, 08:57:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX6S4AVM08ABRLast Revision (GMT):
Wednesday, 27 December 2023, 08:57:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - SAC, Lead FreeTest Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
COPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
CU PLATINGTest Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
8 Feb 2023
Test Report
29 Dec 2023
NI PLATINGTest Report
25 May 2023
Test Report
25 May 2023
Test Report
25 May 2023
Test Report
25 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.