MCIMX7D5EVM10SD

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX7D5EVM10SDLast Revision (GMT):
Friday, 18 March 2022, 01:00:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX7D5EVM10SDSOT1525-1LFBGA541912.000000 mg YesYesYesNot ApplicableNot ApplicableNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 520 465572023-02-0373 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3NA
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0000040.0060000.000000
Copper and its compoundsCopper, metal7440-50-80.06376599.8820000.006992
Nickel and its compoundsNickel, metal7440-02-00.0000580.0900000.000006
Zinc and its compoundsZinc, metal7440-66-60.0000140.0220000.000002
Subtotal0.063840100.00000000.007000
Copper PlatingCopper and its compoundsCopper, metal7440-50-839.22233899.9000004.300695
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0392620.1000000.004305
Subtotal39.261600100.00000004.305000
DieInorganic Silicon compoundsSilicon7440-21-310.02798798.0000001.099560
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2046532.0000000.022440
Subtotal10.232640100.00000001.122000
EpoxyInorganic Silicon compoundsSilicon dioxide7631-86-90.29111021.0000000.031920
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.94264368.0000000.103360
PolymersPlastic: EP - Epoxide, Epoxy0.15248611.0000000.016720
Subtotal1.386240100.00000000.152000
Gold PlatingGold and its compoundsGold, metal7440-57-50.10933199.9000000.011988
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001090.1000000.000012
Subtotal0.109440100.00000000.012000
Mold CompoundInorganic Silicon compoundsSilica, vitreous60676-86-0539.56770087.50000059.163125
Inorganic compoundsCarbon Black1333-86-43.0832440.5000000.338075
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-430.8324405.0000003.380750
PolymersPlastic: EP - Epoxide, Epoxy43.1654167.0000004.733050
Subtotal616.648800100.000000067.615000
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0007660.1000000.000084
Nickel and its compoundsNickel, metal7440-02-00.76531499.9000000.083916
Subtotal0.766080100.00000000.084000
Solder BallCopper and its compoundsCopper, metal7440-50-80.4495250.5000000.049290
Nickel and its compoundsNickel, metal7440-02-00.0449520.0500000.004929
Silver and its compoundsSilver, metal7440-22-41.0788601.2000000.118296
Tin and its compoundsTin, metal7440-31-588.33162398.2500009.685485
Subtotal89.904960100.00000009.858000
Solder MaskBarium and its compoundsBarium sulfate7727-43-73.24900015.0000000.356250
Cyanide compoundsPhthalocyanine Blue57455-37-50.1083000.5000000.011875
Inorganic Silicon compoundsSilica, vitreous60676-86-00.6498003.0000000.071250
Magnesium and its compoundsTalc14807-96-60.6498003.0000000.071250
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6498003.0000000.071250
Organic compoundsOther organic compounds.0.1083000.5000000.011875
PolymersAcrylic acid ester copolymer78506-70-41.6245007.5000000.178125
PolymersPlastic: EP - Epoxide, Epoxy5.41500025.0000000.593750
PolymersPlastic: MMA-Acrylic Copolymer9.20550042.5000001.009375
Subtotal21.660000100.00000002.375000
Substrate Build UpInorganic Silicon compoundsFibrous-glass-wool65997-17-313.69915245.0000001.502100
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-416.74340855.0000001.835900
Subtotal30.442560100.00000003.338000
Substrate CoreCopper and its compoundsCopper, metal7440-50-845.66110445.0000005.006700
Inorganic Silicon compoundsFibrous-glass-wool65997-17-330.44073630.0000003.337800
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-425.36728025.0000002.781500
Subtotal101.469120100.000000011.126000
WireCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000000
Gold and its compoundsGold, metal7440-57-50.05419999.0480000.005943
Palladium and its compoundsPalladium, metal7440-05-30.0005200.9500000.000057
Subtotal0.054720100.00000000.006000
Total912.000000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX7D5EVM10SD
Product content declaration of MCIMX7D5EVM10SD
上次修订 Last Revision (GMT):
Friday, 18 March 2022, 01:00:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

半导体芯片
Die
OOOOOO

环氧胶
Epoxy
OOOOOO

镀金材料
Gold Plating
OOOOOO

模塑料
Mold Compound
OOOOOO

镀镍层
Nickel Plating
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO

线
Wire
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX7D5EVM10SDLast Revision (GMT):
Friday, 18 March 2022, 01:00:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.