MCIMX7U3DVK07SD

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MCIMX7U3DVK07SDLast Revision (GMT):
Wednesday, 23 November 2022, 12:26:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX7U3DVK07SDSOT1849VFBGA36116.355051 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 021 055572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.32930598.1000008.127795
Gold and its compoundsGold, metal7440-57-50.0013550.1000000.008285
Palladium and its compoundsPalladium, metal7440-05-30.0243911.8000000.149134
Subtotal1.355051100.00000008.285214
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.0500005.0000000.305716
Inorganic Silicon compoundsSilica, vitreous60676-86-00.67000067.0000004.096594
Inorganic Silicon compoundsSilicon dioxide7631-86-90.25000025.0000001.528580
Inorganic compoundsCarbon Black1333-86-40.0050000.5000000.030572
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0250002.5000000.152858
Subtotal1.000000100.00000006.114319
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.10000010.0000000.611432
Inorganic Silicon compoundsSilicon dioxide7631-86-90.25000025.0000001.528580
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.30000030.0000001.834296
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.25000025.0000001.528580
PolymersAcrylic acid ester copolymer78506-70-40.10000010.0000000.611432
Subtotal1.000000100.00000006.114319
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-310.78000098.00000065.912359
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2200002.0000001.345150
Subtotal11.000000100.000000067.257510
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0050000.5000000.030572
Silver and its compoundsSilver, metal7440-22-40.0100001.0000000.061143
Tin and its compoundsTin, metal7440-31-50.98500098.5000006.022604
Subtotal1.000000100.00000006.114319
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-80.19928099.9900001.218462
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000122
Subtotal0.199300100.00000001.218584
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.27437399.9900001.677601
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000270.0100000.000168
Subtotal0.274400100.00000001.677769
Gold PlatingGold and its compoundsGold, metal7440-57-50.01939899.9900000.118606
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000012
Subtotal0.019400100.00000000.118618
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000560.0300000.000345
Nickel and its compoundsNickel, metal7440-02-00.18794499.9700001.149147
Subtotal0.188000100.00000001.149492
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.02191229.1000000.133979
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0004520.6000000.002762
Magnesium and its compoundsTalc14807-96-60.0022593.0000000.013812
Organic compoundsOther organic compounds.0.0027113.6000000.016575
PolymersPlastic: EP - Epoxide, Epoxy0.01475919.6000000.090240
PolymersPlastic: PAK0.03320744.1000000.203040
Subtotal0.075300100.00000000.460408
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-30.07795232.0000000.476623
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0146166.0000000.089367
PolymersPlastic: PI - Polyimide0.15103262.0000000.923458
Subtotal0.243600100.00000001.489448
Total16.355051100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX7U3DVK07SD
Product content declaration of MCIMX7U3DVK07SD
上次修订 Last Revision (GMT):
Wednesday, 23 November 2022, 12:26:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX7U3DVK07SDLast Revision (GMT):
Wednesday, 23 November 2022, 12:26:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Not Available
Semiconductor DieTest Report
1 Feb 2024
Test Report
1 Feb 2024
Test Report
1 Feb 2024
Test Report
1 Feb 2024
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
10 May 2023
Test Report
10 May 2023
Test Report
10 May 2023
Test Report
10 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.