MF0AES2000DA8J

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MF0AES2000DA8JLast Revision (GMT):
Wednesday, 28 February 2024, 01:40:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MF0AES2000DA8JSOT500PLLMC13.528204 mg NoYesYesSilver (Ag)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 239 731182023-11-257NA / Not AvailableNot ApplicableNot ApplicableNA / Not AvailableNot ApplicableNot ApplicableNot ApplicableBangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000002
Gold and its compoundsGold, metal7440-57-50.01283398.8400000.094864
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0080000.000008
Palladium and its compoundsPalladium, metal7440-05-30.0001491.1500000.001104
Subtotal0.012984100.00000000.095977
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgPhosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-09.300000100.00000068.745267
Subtotal9.300000100.000000068.745267
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-40.0780002.0000000.576573
Inorganic Silicon compoundsQuartz14808-60-70.0390001.0000000.288287
Inorganic Silicon compoundsSilica, vitreous60676-86-02.73000070.00000020.180062
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2730007.0000002.018006
Inorganic compoundsCarbon Black1333-86-40.0117000.3000000.086486
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0663001.7000000.490087
PolymersPlastic: EP - Epoxide, Epoxy0.70200018.0000005.189159
Subtotal3.900000100.000000028.828660
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-70.0030003.0000000.022176
Inorganic Silicon compoundsSilica, vitreous60676-86-00.05500055.0000000.406558
Organic compoundsOther organic compounds.0.0020002.0000000.014784
PolymersFatty acids, C18-unsatd., dimers, polymers with epichlorohydrin68475-94-50.0050005.0000000.036960
PolymersPlastic: EP - Epoxide, Epoxy0.03500035.0000000.258719
Subtotal0.100000100.00000000.739196
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000100.0100000.000074
Silver and its compoundsSilver, metal7440-22-40.09999099.9900000.739123
Subtotal0.100000100.00000000.739196
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-30.10388798.0000000.767929
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0021202.0000000.015672
Subtotal0.106007100.00000000.783601
Metallization LayerGold and its compoundsGold, metal7440-57-50.00721299.9900000.053311
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000005
Subtotal0.007213100.00000000.053317
Under Bump Metal 1Titanium and its compoundsTitanium, metal7440-32-60.0000252.5000000.000185
Tungsten and its compoundsTungsten, metal7440-33-70.00097597.5000000.007207
Subtotal0.001000100.00000000.007392
Under Bump Metal 2Gold and its compoundsGold, metal7440-57-50.00099999.9900000.007391
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Subtotal0.001000100.00000000.007392
Total13.528204100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MF0AES2000DA8J
Product content declaration of MF0AES2000DA8J
上次修订 Last Revision (GMT):
Wednesday, 28 February 2024, 01:40:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

金属化层
Metallization Layer
OOOOOO

焊料凸点下的金属
Under Bump Metal 1
OOOOOO

焊料凸点下的金属
Under Bump Metal 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MF0AES2000DA8JLast Revision (GMT):
Wednesday, 28 February 2024, 01:40:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-Frame, Pre-Plated AgTest Report
20 May 2020
Test Report
20 May 2020
Test Report
20 May 2020
Test Report
16 Aug 2019
Die EncapsulantTest Report
10 Apr 2023
Test Report
10 Apr 2023
Test Report
10 Apr 2023
Not Available
Epoxy AdhesiveTest Report
30 Aug 2023
Test Report
30 Aug 2023
Test Report
30 Aug 2023
Test Report
30 Aug 2023
Pre-plating - Precious metal - AgTest Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Semiconductor DieAU BUMPTest Report
16 Dec 2022
Test Report
16 Dec 2022
Test Report
27 Dec 2021
Test Report
27 Dec 2021
AU UBMTest Report
16 Dec 2022
Test Report
16 Dec 2022
Not AvailableNot Available
DIETest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
TIW UBMTest Report
23 Feb 2021
Test Report
23 Feb 2021
Test Report
23 Feb 2021
Test Report
23 Feb 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.