MF1S5000XDA8/V1J

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MF1S5000XDA8/V1JLast Revision (GMT):
Monday, 04 March 2024, 01:58:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MF1S5000XDA8/V1JSOT500PLLMC13.495576 mg NoYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 028 241182023-11-2511NA / Not AvailableNot ApplicableNot ApplicableNA / Not AvailableNot ApplicableNot ApplicableNot ApplicableBangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000002
Gold and its compoundsGold, metal7440-57-50.01295398.8400000.095987
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0080000.000008
Palladium and its compoundsPalladium, metal7440-05-30.0001511.1500000.001117
Subtotal0.013106100.00000000.097113
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-88.63680892.86890063.997326
Iron and its compoundsIron, metal7439-89-60.0093000.1000000.068912
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000930.0010000.000689
Nickel and its compoundsNickel, metal7440-02-00.0278910.2999000.206666
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0167770.1804000.124316
Tin and its compoundsTin, metal7440-31-50.5812416.2499004.306898
Zinc and its compoundsZinc, metal7440-66-60.0278910.2999000.206666
Subtotal9.300000100.000000068.911472
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-40.0780002.0000000.577967
Inorganic Silicon compoundsQuartz14808-60-70.0390001.0000000.288984
Inorganic Silicon compoundsSilica, vitreous60676-86-02.73000070.00000020.228851
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2730007.0000002.022885
Inorganic compoundsCarbon Black1333-86-40.0117000.3000000.086695
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0663001.7000000.491272
PolymersPlastic: EP - Epoxide, Epoxy0.70200018.0000005.201705
Subtotal3.900000100.000000028.898359
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-70.0030003.0000000.022229
Inorganic Silicon compoundsSilica, vitreous60676-86-00.05500055.0000000.407541
Organic compoundsOther organic compounds.0.0020002.0000000.014820
PolymersFatty acids, C18-unsatd., dimers, polymers with epichlorohydrin68475-94-50.0050005.0000000.037049
PolymersPlastic: EP - Epoxide, Epoxy0.03500035.0000000.259344
Subtotal0.100000100.00000000.740984
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000100.0100000.000074
Silver and its compoundsSilver, metal7440-22-40.09999099.9900000.740909
Subtotal0.100000100.00000000.740984
Semiconductor DieDieGold and its compoundsGold, metal7440-57-50.0016492.0000000.012222
Inorganic Silicon compoundsSilicon7440-21-30.08082198.0000000.598867
Subtotal0.082470100.00000000.611089
Total13.495576100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MF1S5000XDA8/V1J
Product content declaration of MF1S5000XDA8/V1J
上次修订 Last Revision (GMT):
Monday, 04 March 2024, 01:58:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MF1S5000XDA8/V1JLast Revision (GMT):
Monday, 04 March 2024, 01:58:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-FrameAG PLATINGTest Report
5 Jan 2023
Test Report
5 Jan 2023
Test Report
5 Jan 2023
Test Report
5 Jan 2023
C5191Test Report
5 Jan 2023
Test Report
5 Jan 2023
Test Report
5 Jan 2023
Test Report
5 Jan 2023
Die EncapsulantTest Report
10 Apr 2023
Test Report
10 Apr 2023
Test Report
10 Apr 2023
Not Available
Epoxy AdhesiveTest Report
30 Aug 2023
Test Report
30 Aug 2023
Test Report
30 Aug 2023
Test Report
30 Aug 2023
Pre-plating - Precious metal - AgTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Semiconductor DieAUTest Report
16 Dec 2022
Test Report
16 Dec 2022
Test Report
24 Aug 2021
Test Report
24 Aug 2021
AU BUMPTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
DIETest Report
29 Aug 2023
Test Report
29 Aug 2023
Test Report
29 Aug 2023
Test Report
29 Aug 2023
TIWTest Report
13 Apr 2023
Test Report
13 Apr 2023
Test Report
13 Apr 2023
Test Report
13 Apr 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.