MF4SAM3X84/9BA6AUJ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MF4SAM3X84/9BA6AUJLast Revision (GMT):
Wednesday, 19 April 2023, 10:04:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MF4SAM3X84/9BA6AUJSOT658PLLCC8125.772604 mg YesYesYesOtherOthere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 871 781182022-01-269NA / Not AvailableNot ApplicableNot ApplicableNA / Not AvailableNot ApplicableNot ApplicableNot ApplicableBangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000001
Beryllium and its compoundsBeryllium, metal7440-41-70.0000010.0010000.000001
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000001
Gold and its compoundsGold, metal7440-57-50.09949799.9930000.079109
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000001
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000001
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000001
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000001
Subtotal0.099504100.00000000.079114
Die Encapsulant 1Die EncapsulantAntimony and its compoundsOther antimony compounds0.0096000.0400000.007633
Inorganic Silicon compoundsSilica, vitreous60676-86-010.32000043.0000008.205284
PolymersPlastic: EP - Epoxide, Epoxy13.67040056.96000010.869140
Subtotal24.000000100.000000019.082057
Die Encapsulant 2Die EncapsulantAntimony and its compoundsOther antimony compounds0.0000040.0400000.000003
Inorganic Silicon compoundsSilica, vitreous60676-86-00.00420042.0000000.003339
Inorganic Silicon compoundsSilicon dioxide, syntetic112945-52-50.0001501.5000000.000119
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.0000050.0500000.000004
Magnesium and its compoundsMagnesium-oxide1309-48-40.0000100.1000000.000008
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0002002.0000000.000159
PolymersPlastic: EP - Epoxide, Epoxy0.00543154.3100000.004318
Subtotal0.010000100.00000000.007951
Epoxy AdhesiveEpoxy AdhesiveAntimony and its compoundsOther antimony compounds0.0030000.6000000.002385
Copper and its compoundsCopper phthalocyanine147-14-80.0045000.9000000.003578
Inorganic Silicon compoundsSilicon dioxide, syntetic112945-52-50.0100002.0000000.007951
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.0005000.1000000.000398
Magnesium and its compoundsMagnesium-oxide1309-48-40.0025000.5000000.001988
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0300006.0000000.023853
PolymersPlastic: EP - Epoxide, Epoxy0.31450062.9000000.250055
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.13500027.0000000.107337
Subtotal0.500000100.00000000.397543
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.00999099.9000000.007943
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000100.1000000.000008
Subtotal0.010000100.00000000.007951
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-32.11003898.0000001.677661
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0430622.0000000.034238
Subtotal2.153100100.00000001.711899
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-849.70087199.00000039.516452
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5020291.0000000.399156
Subtotal50.202900100.000000039.915608
Epoxy 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-321.47230852.00000017.072325
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-619.82059248.00000015.759069
Subtotal41.292900100.000000032.831395
Epoxy 2Epoxy ResinsEpoxy resin, EPON Resin 809125928-94-33.22522291.0000002.564328
PolymersOther polymers0.3189789.0000000.253615
Subtotal3.544200100.00000002.817943
Gold PlatingGold and its compoundsGold, metal7440-57-50.33323499.0000000.264950
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0033661.0000000.002676
Subtotal0.336600100.00000000.267626
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0362341.0000000.028809
Nickel and its compoundsNickel, metal7440-02-03.58716699.0000002.852104
Subtotal3.623400100.00000002.880914
Total125.772604100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MF4SAM3X84/9BA6AUJ
Product content declaration of MF4SAM3X84/9BA6AUJ
上次修订 Last Revision (GMT):
Wednesday, 19 April 2023, 10:04:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

环氧胶
Epoxy 1
OOOOOO

环氧胶
Epoxy 2
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MF4SAM3X84/9BA6AUJLast Revision (GMT):
Wednesday, 19 April 2023, 10:04:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die Encapsulant 1Test Report
21 Jan 2020
Test Report
21 Jan 2020
Test Report
21 Jan 2020
Test Report
21 Jan 2020
Die Encapsulant 2Test Report
21 Jan 2020
Test Report
21 Jan 2020
Test Report
21 Jan 2020
Test Report
21 Jan 2020
Epoxy AdhesiveTest Report
10 Apr 2020
Test Report
10 Apr 2020
Test Report
10 Apr 2020
Not Available
Pre-plating - Precious metal - OtherNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.